Intern - Process & Equipment Engineer (Diffusion)

Micron; Singapore; On-site; SGD 17,000 - 23,000; Full time

Job summary

Micron Technology, Inc. in Singapore invites a full-time intern to work on Enhancing Poly-SiGe gap fill in HAR structures to improve die strength and reduce wafer bending.

You will study deposition conditions, film growth, and correlate gap-fill with mechanical integrity. The role offers hands-on experience in material science, AI-enabled workflows, DOE planning, and cross-functional collaboration with engineering teams.

Qualifications

• Strong analytical and problem-solving skills.
• Familiarity with machine learning, statistics, and AI-enabled workflows.
• Knowledge of semiconductor materials, thin-film deposition and process integration.

Responsibilities

• Study deposition conditions and film growth in HAR structures.
• Coordinate with cross-functional teams on problem definition and qualification proposals.
• Deliver DOE matrices and SEM/TEM analyses to correlate fill quality with mechanical integrity.

Skills

Analytical skills

Machine learning familiarity

Statistical analysis

Semiconductor materials knowledge

Design of Experiments

Education

Engineering degree (pursuing)

Tools

SEM

TEM

Job description

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.

Enhancing Poly-SiGe Gap Fill Performance in High Aspect Ratio Structures for Improved Die Strength and Reduced Wafer/Dice Bending

Project Description

This project aims to improve Poly-SiGe gap filling in high aspect ratio (HAR) structures to enhance die strength and reduce block bending. The intern will study the impact of deposition conditions on film growth, conformality, and void formation, identify strategies to improve fill performance while minimizing early pinch-off, and correlate gap-fill characteristics with mechanical integrity. The outcome will be a deeper understanding of the key mechanisms governing successful HAR feature filling and die-strength improvement.

Project Scope

• Investigate effects of process parameters on fill depth and gap-fill in HAR structure
• Identify process conditions that improve bottom-up fill while maintaining open feature entrances
• Identify critical fill characteristics that contribute most to structural robustness
• Recommend optimized window and qualification plan

Learning Opportunities

• Gain hands-on application on material science and semiconductor integration
• Experience the end-to-end development cycle from problem definition to qualification proposal
• Collaborate with cross-functional engineering teams and subject matter experts

Deliverables

• Quantitative comparison of voids, seams, and pinch-off behavior
• DOE and experimental matrix with SEM/TEM cross-section analysis of filled structures
• Correlation between fill quality and die-strength/block-bending performance to recommend process window

Impact of Project

Enhances die strength and reduces block bending through improved feature-fill quality and stress management. Provides a scalable process solution that can improve yield, reliability, and manufacturability for future technology nodes.

Skillsets Required

• Strong analytical and problem-solving skills
• Familiarity with machine learning, statistical analysis, and AI-enabled workflows
• Familiarity with semiconductor materials, thin-film deposition, process integration, or materials characterization
• Familiarity with Design of Experiments, statistical analysis, and interpretation of experimental data

Course of Interest

The ideal candidate should be currently pursuing a degree in Engineering, or a related field.

Duration

The ideal candidate should be able to commit to a full-time internship period of at least 5 months from Jan to Jun 2027.

About Micron Technology, Inc.

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities - from the data center to the intelligent edge and across the client and mobile user experience. To learn more, please visit micron.com/careers

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

To request assistance with the application process and/or for reasonable accommodations, please contact [e-mail]

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.