Principal Product Testing Engineer for NAND Flash

Brightecs Innovation Pte Ltd; Singapore; On-site; SGD 80,000 - 100,000; Full time

Job summary

Brightecs Innovation Pte Ltd in Singapore is seeking a skilled professional responsible for testing and analyzing NAND memory products, developing test equipment, and ensuring product reliability. Candidates should hold a Master's degree in relevant fields and possess strong skills in C/C++, Python, and ATE development.

The role involves collaboration with design teams to identify failure causes and enhance product quality.

Qualifications

• Master’s degree or above in microelectronics, integrated circuits, electronic engineering, computer science, automation, physics or materials science.
• Experience with semiconductor product testing and memory chip projects is a plus.
• Familiarity with design-for-test methodologies and performance indicators.

Responsibilities

• Perform reliability testing and analysis of NAND memory products.
• Develop and maintain test equipment including implementing test modes.
• Analyze causes of product failures and collaborate with teams for solutions.
• Support system-level product testing to ensure efficiency.

Skills

C/C++ proficiency

Python proficiency

Perl proficiency

Logical analysis

Problem-solving

Communication skills

Teamwork skills

Education

Master’s degree in microelectronics or related STEM fields

Tools

ATE development (e.g., T5830, T5833, Magnum V93K)

UNIX/Linux environments

Job description

Responsibilities

• Responsible for the performance, power consumption, and reliability testing and analysis of NAND memory products, and formulating test specifications and verification processes.
• Develop and maintain test equipment (ATE), including the definition and implementation of test modes such as BIST, DFT, and DFM, continuously improving test coverage and optimizing test time.
• Locate the causes of product failures after delivery and at the wafer stage through electrical failure analysis, design circuit analysis, physical failure analysis, and data analysis.
• Collaborate with the product design team and process team to identify the root causes of failures and drive the implementation of solutions.
• Support the testing and debugging of products in system‑level applications (such as SSD, UFS, eMCP) to ensure efficient use by customers and the system side.
• Complete user manual verification, product test function verification, and participate in other test‑related tasks assigned by the supervisor.

Required Qualifications

1. Education and major: Master’s degree or above in microelectronics, integrated circuits, electronic engineering, computer science, automation, physics, materials science, or other related STEM fields.
2. Experience requirements:
   • Familiar with semiconductor product principles and testing mechanisms; background in memory (NOR/NAND Flash, SRAM, DRAM, phase‑change memory, ferroelectric, etc.) testing or design verification is a plus.
   • Experience in testing 3D‑NAND, TLC/QLC, or flash memory products is a plus.
   • Experience with successfully tape‑out and mass‑produced memory chip projects is a plus.
3. Technical skills:
   • Proficient in C/C++, Python, Perl, etc., and familiar with UNIX/Linux environments.
   • Experience in ATE (Automatic Test Equipment) development (e.g., T5830, T5833, Magnum V93K, etc.).
   • Familiar with the functions, performance, and reliability indicators of memory products.
   • Familiar with design‑for‑test (CFT), DFM, and other design‑for‑test (CFT) methodologies.
4. Other skills:
   • Strong logical analysis, learning, and problem‑solving abilities.
   • Good communication, organizational, and teamwork skills.
   • Proactive, steady, meticulous, responsible, and able to work under pressure.