Principal / Master PCB Layout Engineer

LITE-ON SINGAPORE PTE. LTD.; Singapore; On-site; SGD 90,000 - 120,000; Full time

Job summary

LITEON Singapore invites an experienced PCB Layout Engineer to join the CIPS Research Team in Singapore. You will lead PCB layout activities for high-current, high-speed data center applications, from concept to validated prototypes, collaborating with electrical, mechanical, and vendor teams.

The role emphasizes design for manufacturability, compliance, and reliability, with opportunities to publish and innovate in energy-efficient data storage and AI cloud infrastructure.

Qualifications

• Degree in Electrical/Electronic Engineering or related field.
• 6+ years of PCB layout experience.
• Experience leading layouts for complex multilayer PCBs.
• Proficient with PCB design tools (OrCad, PADS, Altium, Cadence Allegro).
• Strong knowledge of high-current routing, high-voltage design, and EMI/EMC principles.

Responsibilities

• Lead PCB layout activities from concepts to product-ready designs.
• Own board stack-up, component placement, routing and optimization for high-current/high-speed.
• Develop PCB design processes for high voltage/power designs with safety compliance.
• Drive signal/power integrity, EMI/EMC, thermal optimization, and DFM/DFT.
• Collaborate with electrical and mechanical teams for integration.
• Interface with fabricators/assembly partners for prototypes.
• Lead design reviews and provide technical leadership.

Skills

PCB layout

High-current routing

Signal integrity

EMI/EMC design

Power electronics

FPGAs / DSPs / MCUs

Team leadership

Education

Bachelor's degree in Electrical/Electronic Engineering

Tools

OrCad

PADS

Altium Designer

Cadence Allegro

Job description

About Us

LITEON is a world-leading provider of optoelectronic semiconductor components and power management modules. At LITEON we put people at the core - LITEON has built a culture of trust and empowerment that enhances employee involvement, engagement, and commitment to excellence.

About the Role

An exciting opportunity has arisen to join our Cloud Infrastructure Platform and Solutions (CIPS) Research Team. Our CIPS Research team is focused on developing future technology systems to support growth in the rapidly evolving data center sector. The successful candidate will be directly involved in early-stage research projects, working with academic institutions, suppliers, customers, and partners to deliver proof of concept designs.

Key Responsibilities

• Lead PCBA layout activities from board conceptsand lab demonstrations to product intent designs.
• Own board stack-up strategy, component placement, routing and optimisation for high-current and high-speed.
• Develop PCB design processes for high voltage/power designs, adhering to compliance and safety requirements.
• Drive best practice in signal/power integrity, EMI/EMC, thermals, design for manufacture and design for test.
• Work closely with electrical engineers to optimise design performance and product integration.
• Collaborate with mechanical/thermal teams to integrate liquid cooling, heatsinks, busbars and connectors.
• Perform design reviews and provide technical leadership across multiple projects.
• Interface with PCB fabricators and assembly partners to deliver optimised and cost-effective prototypes.
• Learn, implement and improve companywide layout methodologies, tools and practices.
• Support design for safety, compliance and reliability.
• Continuously research PCBA technologies for lab demonstrations and product integration.

Requirements

• Degree in Electrical/Electronic Engineering or related field.
• 6+ years of PCB layout experience.
• Experience leading layouts for complex multilayer PCBs, owning review processes.
• Expert knowledge of PCB design tools such as OrCad, PADS, Altium Designer or Cadence Allegro.
• Strong understanding of high-current power routing, creepage and clearance, high-voltage design, differential pair routing, controlled impedance, high speed interfaces, EMC design principles, thermal optimisation and design for manufacturability.
• Experience working with power electronics(AC/DC, DC,DC, etc) and controllers (FPGAs, DSPs, MCUs, etc).
• Desirable experience: working with power modules, GaN and SiC, liquid cooled electronics and HDI technologies.
• Strong analytical, problem-solving, and communication skills.
• Demonstrated passion for innovation and commitment to continuous learning.
• We welcome applicants at all experience levels, from recent graduates to seasoned professionals.

Why Join Us

• World-class R&D environment with well-equipped labs, top-tier industry connections and collaborative teams.
• Shape the future of energy-efficient data storage and AI cloud computing – from renewable energy integration to next generation infrastructure.
• Opportunities to publish, patent and innovate designs for future products.
• Competitive compensation, research autonomy and a continuous learning culture