Principal Engineer, Radio Frequency

POET TECHNOLOGIES PTE. LTD.; Singapore; Sur place; SGD 180 000 - 240 000; Plein temps

Résumé du poste

POET TECHNOLOGIES PTE. LTD. is seeking a senior RF/microwave engineer to lead design strategy across photonic and semiconductor products. You will set technical direction for antenna, matching networks, and high-frequency interconnects, while guiding a team through simulation and measurement programs.

The role requires 10+ years in RF/microwave design, proficiency in HFSS/SIwave/Q3D/ADS, and strong leadership and communication skills to influence senior stakeholders across locations.

Qualifications

• 10+ years RF/microwave design experience with demonstrated technical leadership.

Responsabilités

• Define and lead RF/microwave design strategy across product lines.
• Guide RF/EM simulation using HFSS, SIwave, Q3D and ADS to solve complex signal/power integrity issues.
• Lead measurement and validation programs including S-parameters and far-field characterization.
• Mentor SI/PI, hardware, and packaging engineers to preserve RF performance through the signal chain.
• Own escalation of RF issues including impedance mismatch, insertion loss, return loss, EMI/EMC.

Connaissances

RF/microwave design

EM simulation

Technical leadership

Cross-functional collaboration

Mentoring

Communication

Formation

Bachelor's/Master's/PhD in Electrical Engineering

Outils

Ansys HFSS

SIwave

Q3D

ADS

Vector Network Analyzers (VNA)

Anechoic chamber measurement

Description du poste

Responsibilities

• Define and lead the RF/microwave design strategy across our photonic and semiconductor product lines, setting technical direction for antenna, matching network, and high-frequency interconnect architecture.
• Serve as the top technical authority on RF/EM simulation, providing expert guidance on Ansys HFSS, SIwave, Q3D, and ADS to resolve the most complex signal and power integrity challenges.
• Lead RF measurement and validation strategy, including S-parameter testing, antenna far-field characterization, and anechoic chamber measurement programs, and establish best practices across teams.
• Provide technical leadership and mentorship to SI/PI, hardware, and packaging engineers, ensuring RF performance is preserved across the full signal chain, from chip package through PCB.
• Own resolution of critical, escalated RF issues including impedance mismatch, insertion loss, return loss, and EMI/EMC compliance, acting as the final technical escalation point.
• Drive RF design strategy for new product introduction (NPI), partnering with cross-functional leadership to align technical roadmaps with business priorities.
• Author and review technical documentation, design standards, and specifications for RF subsystems across the organization.
• Represent RF engineering capability with external partners, PCB fabrication/assembly vendors, and key customers.
• Track emerging high-frequency protocols and industry standards (100G/200G/400G/800G) and translate them into forward-looking design roadmaps.
• Mentor and develop junior and mid-level RF engineers, building organizational depth in RF competency.

Requirements

• Bachelor's, Master's, or Ph.D. in Electrical Engineering, RF/Microwave Engineering, or a related field.
• Minimum 10+ years of RF/microwave design experience, with a demonstrated track record of technical leadership.
• Deep expertise in EM simulation tools such as Ansys HFSS, SIwave, Q3D, and ADS, with demonstrated ability to resolve highly complex RF challenges.
• Extensive hands-on experience with RF measurement equipment, including Vector Network Analyzers (VNA) and antenna far-field measurement systems.
• Deep understanding of RF fundamentals, including impedance matching, S-parameters, antenna theory, and EMI/EMC principles.
• Demonstrated experience leading or mentoring engineering teams.
• Strong track record of cross-functional collaboration at a senior level.
• Excellent written and verbal communication skills in English, with the ability to communicate technical strategy to senior leadership.

Preferred Qualifications

• Experience in optical communications or semiconductor packaging environments at a senior or principal level.
• Deep familiarity with high-speed protocols such as PCIe, DDR, or high-speed SerDes.
• Experience with chip-package-board co-design and simulation at scale.
• Track record of leading mass production ramp and yield improvement initiatives.
• Patents or publications in RF/microwave design.

Location

This role can be based in Singapore, China, or Taiwan.