Principal Engineer, Cell Film Process for 3D NAND Scaling

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.; Singapore; On-site; SGD 180,000 - 240,000; Full time

Job summary

Micron Semiconductor Asia Operations Pte. Ltd. in Singapore seeks a Principal Engineer to lead cell film process development, define strategic direction, and drive manufacturability at scale for next‑generation NAND devices.

You will lead cross‑functional teams, own end‑to‑end module development, and ensure successful transfer into high‑volume manufacturing. The role requires solving complex technical challenges, mentoring engineers, and collaborating with internal and external partners while

Qualifications

• PhD with ≥5 years (or Master’s ≥7, or Bachelor’s ≥10) in Electrical Engineering, Materials Science, Chemical Engineering, Physics or related field.
• Experience leading thin film R&D for microelectronic devices and managing complex technology development.

Responsibilities

• Define and implement technical strategy for cell film process development aligned to business goals.
• Lead multi-functional development, integration, and scaling of thin film processes for advanced NAND devices; ensure manufacturability and scalability for high-volume manufacturing.
• Drive technology transfer and ramp-up to ensure seamless transition from R&D to manufacturing.
• Resolve complex technical challenges (RCA/mitigation of failures) and lead yield improvement programs through process/material innovations.
• Mentor senior engineers, shape technical direction, and represent the function in external forums and collaborations.

Skills

ALD/CVD processes

Process–device interactions

Materials & chemistry improvements

DOE, SPC & analytics

Technical leadership & mentoring

Education

PhD≥5 yrs or Masters≥7 yrs or Bachelors≥10 yrs in EE/Materials/Chemical Eng/Physics

Job description

Micron Semiconductor Asia Operations Pte. Ltd. in Singapore seeks a Principal Engineer to lead cell film process development, define strategic direction, and drive manufacturability at scale for next‑generation NAND devices.

You will lead cross‑functional teams, own end‑to‑end module development, and ensure successful transfer into high‑volume manufacturing. The role requires solving complex technical challenges, mentoring engineers, and collaborating with internal and external partners while