MTS - Process Integration Lead (TD)

GLOBALFOUNDRIES SINGAPORE PTE. LTD.; Singapore; Presencial; SGD 150 000 - 230 000; Tempo integral

Resumo da oferta

GlobalFoundries Singapore is seeking a Process Integration Lead to drive RF semiconductor technology development and qualification. You will design and analyze experiments, collaborating with module, device, yield, reliability, and manufacturing teams to push performance and yield targets.

The role requires strong domain knowledge in FEOL and wafer fabrication, plus leadership to guide cross-functional projects and mentor junior engineers. Excellent communication with customers is essential.

Qualificações

• Bachelor’s, Master’s or PhD in Electrical/Electronics engineering or equivalent.
• Minimum 6 years with PhD or 8 years with Bachelor/Master in semiconductors.
• Strong wafer fabrication & FEOL process integration experience.
• Proven ability to lead cross-functional technical projects.
• Strong analytical and problem-solving with data interpretation.

Responsabilidades

• Lead process integration for development, optimization and qualification of RF semiconductor technologies.
• Design, execute and analyze DOEs to drive process understanding and development.
• Collaborate with process module, device, yield, reliability and manufacturing teams to improve performance.
• Own and drive complex technical problem-solving using data-driven methods.
• Serve as primary technical interface for internal and external customers.
• Define technology design rules, monitors, test structures and qualification methodologies.
• Drive continuous innovation through new integration schemes and process improvements.
• Mentor junior engineers and provide technical leadership across programs.

Conhecimentos

Wafer fabrication knowledge

DOE design & analysis

Cross-functional leadership

Data interpretation

Analytical problem-solving

Formação académica

Electrical/Electronics engineering degree (Bachelors/Master's/PhD)

Ferramentas

RF characterization techniques (S-parameters)

Descrição da oferta de emprego

About GlobalFoundries

GlobalFoundries (GF) is a leading manufacturer of essential semiconductors, enabling AI at scale from the cloud to the physical world. Through deep partnerships with customers, GF delivers differentiated,power efficient and high-performance solutions for high growth markets. With global manufacturing operations across the U.S., Europe and Asia, GF is a trusted and holistic technology partner for customers around the world. GF’s talented, global teamremainsfocused every day on security, longevity, and sustainability. For more information, visit www.gf.com.

Introduction:

Process integration lead in development, optimization, and qualification of semiconductor devices/processes to meet performance requirements.

Responsibilities:

• Lead process integration activities for the development, optimization, and qualification of RF semiconductor technologies, ensuring device performance, manufacturability, yield, and reliability targets are achieved.
• Design, execute, and analyze Design of Experiments (DOE) to drive process understanding, optimization, and technology development.
• Partner closely with process module, device, yield, reliability, and manufacturing teams to improve product performance and process capability.
• Own and drive complex technical problem-solving activities, utilizing data-driven methodologies to identify root causes and implement robust solutions.
• Serve as the primary technical interface for internal and external customers, addressing technical inquiries and supporting customer engagements.
• Define and establish technology design rules, process monitors, test structures, characterization plans, and qualification methodologies for new technology platforms.
• Drive continuous innovation through the development of novel integration schemes, methodologies, and process improvements to enhance technology competitiveness.
• Mentor junior engineers and provide technical leadership across cross-functional development programs.

Required Qualifications:

• Bachelor’s, Master’s, or PhD degree in Electrical Engineering, Electronics Engineering or equivalent.
• Minimum 6 years of relevant semiconductor industry experience with a PhD, or 8 years with a Bachelor’s/Master’s degree.
• Strong wafer fabrication process knowledge with proven experience in FEOL process integration and technology development.
• Demonstrated ability to lead cross-functional technical projects and drive issues to resolution in a fast-paced development environment.
• Strong analytical, problem-solving, and data interpretation skills.

Preferred Qualifications:

• Hands-on experience in RF-SOI technology development, integration, characterization, and qualification.
• Understanding of semiconductor device physics, RF device behavior, and RF characterization techniques (e.g., S-parameters) is a plus.
• Experience in process optimization, yield enhancement, reliability qualification, and root-cause analysis methodologies.
• Self-motivated, resourceful, and adaptable, with a strong commitment to continuous learning and technical excellence.
• Excellent communication, leadership, and interpersonal skills, with the ability to influence and collaborate effectively across multidisciplinary teams.
• Experience interfacing with customers and presenting technical results to senior management and external stakeholders.