Lead Engineer – Advanced NAND Thin‑Film & Tech Strategy

Micron Technology, Inc.; Singapore; On-site; SGD 180,000 - 240,000; Full time

Job summary

Micron Technology, Inc. is seeking a senior engineer to define and lead the strategy for cell film processes in Singapore. You will drive end-to-end development, scale thick/thin film processes for 3D NAND, and manage technology transfer from R&D to high-volume manufacturing.

You will troubleshoot complex process/device failures, lead reliability programs, and mentor engineers while collaborating across product and manufacturing teams to deliver state-of-the-art memory solutions.

Qualifications

• PhD with 5+ years in Electrical Engineering, Materials Science, Chemical Engineering, Physics or related field; experience in thin film R&D for microelectronic devices.
• Strong hands-on expertise in ALD/CVD thin film processes for 3D NAND cell applications, including process development and manufacturing sustainment.
• Proven ability to drive material/process improvements through structured experimentation and cross-functional collaboration.

Responsibilities

• Define and implement technical strategy for cell film process development aligned to business objectives.
• Lead multi-functional development, integration, and scaling of thin film processes for advanced NAND devices; ensure manufacturability and scalability.
• Drive technology transfer and ramp-up activities from R&D to high-volume manufacturing.
• Resolve complex technical challenges and lead cost reduction, yield improvement, and reliability programs.
• Mentor senior engineers and represent the function in technical forums and collaborations.

Skills

Thin film ALD/CVD

Process development

DOE/Statistical methods

Data analytics

Cross-functional collaboration

Reliability analysis

Education

PhD

Master's

Bachelor's

Tools

DOE tools

SPC

Statistical software

Job description

Micron Technology, Inc. is seeking a senior engineer to define and lead the strategy for cell film processes in Singapore. You will drive end-to-end development, scale thick/thin film processes for 3D NAND, and manage technology transfer from R&D to high-volume manufacturing.

You will troubleshoot complex process/device failures, lead reliability programs, and mentor engineers while collaborating across product and manufacturing teams to deliver state-of-the-art memory solutions.