Lab Technician (Semiconductor Substrate)

ETHOS SEARCH ASSOCIATES PTE. LTD.; Singapore; On-site; SGD 31,000 - 47,000; Full time

Job summary

ETHOS SEARCH ASSOCIATES PTE. LTD.

is seeking a skilled technician to prepare PCB and semiconductor package samples, including cross-sectioning, mounting, grinding and polishing, for failure analysis and material characterization. You will perform optical microscopy and SEM inspections, analyze images for layer thickness and defects, document findings, and deliver technical reports while communicating results to engineers and project stakeholders.

Qualifications

• Diploma in Engineering, Materials Science, Electronics, or related field.
• 2+ years hands-on semiconductor package prep, mounting, grinding, polishing, and cross-sectioning.
• Experience with optical microscopes and SEM.
• Experience in image analysis, metrology, and technical reporting software.
• Ability to identify defects: voids, cracks, contamination, delamination.
• Knowledge of semiconductor packaging and PCB manufacturing processes.
• Strong attention to detail and technical documentation.
• Ability to work independently and with engineering teams.

Responsibilities

• Prepare PCB and semiconductor package samples through cross-sectioning, mounting, grinding, and polishing.
• Perform optical microscopy inspections and SEM analysis for failure analysis and material characterization.
• Analyze cross-sectional images to evaluate layer thickness, plating quality, via structures, solder joints, and material interfaces.
• Operate and maintain laboratory equipment, including cross-section preparation tools, optical microscopes, and SEM systems.
• Document inspection results, observations, and analysis findings accurately.
• Prepare technical reports detailing inspection results and material characterization findings.
• Communicate analysis results and technical findings to engineers and project stakeholders.
• On-the-job training opportunities in AI-assisted reporting and data analysis tools.

Skills

Semiconductor sample prep

Cross-sectioning

Microscopy operation

Image analysis

Technical reporting

Collaboration with engineers

Attention to detail

Education

Diploma in Engineering/ Materials Science / Electronics

Tools

Optical microscope

SEM

Image analysis software

Metrology software

Job description

Responsibilities

• Prepare PCB and semiconductor package samples through cross-sectioning, mounting, grinding, and polishing.
• Perform optical microscopy inspections and Scanning Electron Microscopy (SEM) analysis for failure analysis and material characterization.
• Analyze cross-sectional images to evaluate layer thickness, plating quality, via structures, solder joints, and material interfaces.
• Operate and maintain laboratory equipment, including cross-section preparation tools, optical microscopes, and SEM systems.
• Document inspection results, observations, and analysis findings accurately.
• Prepare technical reports detailing inspection results and material characterization findings.
• Communicate analysis results and technical findings to engineers and project stakeholders.

Requirements

• Minimum Diploma in Engineering, Materials Science, Electronics, or a related field.
• 2 years or more of hands-on experience in semiconductor package sample preparation, mounting, grinding, polishing, and cross-sectioning.
• Experience operating optical microscopes and SEM equipment.
• Experience in image analysis, metrology, and technical reporting software.
• Ability to identify and document defects, including voids, cracks, contamination, and delamination.
• Familiarity with semiconductor packaging and PCB manufacturing processes.
• Strong attention to detail, analytical thinking, and technical documentation skills.
• Ability to work independently and collaborate effectively with engineering teams.

Future Skill Development Opportunities (On-the-Job Training)

• Learn AI-assisted tools for report generation and test result documentation.
• Assist in managing largedatasets and performing trend analysis for process monitoring.
• Collaborate with engineers on machine vision and AI-based defect detection projects.

EA License No: 13C6655
EA Reg No: R1109557 Rose