Lab Technician (Semiconductor Substrate)

Ethos Search Associates Pte Ltd; Singapore; On-site; SGD 42,000 - 60,000; Full time

Job summary

Ethos Search Associates Pte Ltd is seeking a detail‑oriented engineer to support failure analysis on PCB and semiconductor packages. You will prepare samples, operate optical microscopes and SEM, and analyze cross‑sectional images to assess layer thickness and interface quality.

You will document results, generate technical reports, and communicate findings to engineers and stakeholders. The role requires a diploma in engineering or related fields and hands‑on experience in semiconductor prep.

Qualifications

• Must have 2+ years hands-on experience in semiconductor package sample preparation, including mounting, grinding, polishing, and cross-sectioning.
• Experience with optical microscopes and SEM equipment.
• Experience in image analysis, metrology, and technical reporting software.
• Ability to identify and document defects, including voids, cracks, contamination, and delamination.
• Familiarity with semiconductor packaging and PCB manufacturing processes.
• Strong attention to detail and analytical documentation skills.
• Ability to work independently and collaborate with engineering teams.

Responsibilities

• Prepare PCB and semiconductor package samples through cross-sectioning, mounting, grinding, and polishing.
• Perform optical microscopy inspections and Scanning Electron Microscopy (SEM) analysis for failure analysis and material characterization.
• Analyze cross-sectional images to evaluate layer thickness, plating quality, via structures, solder joints, and material interfaces.
• Operate and maintain laboratory equipment, including cross-section preparation tools, optical microscopes, and SEM systems.
• Document inspection results, observations, and analysis findings accurately.
• Prepare technical reports detailing inspection results and material characterization findings.
• Communicate analysis results and technical findings to engineers and project stakeholders.

Skills

Semiconductor sample prep

Cross-sectioning

Mounting and polishing

Optical microscope operation

SEM operation

Image analysis

Metrology software

Education

Diploma in Engineering / Materials Science / Electronics

Tools

Optical microscope

SEM system

Job description

Responsibilities

• Prepare PCB and semiconductor package samples through cross-sectioning, mounting, grinding, and polishing.
• Perform optical microscopy inspections and Scanning Electron Microscopy (SEM) analysis for failure analysis and material characterization.
• Analyze cross-sectional images to evaluate layer thickness, plating quality, via structures, solder joints, and material interfaces.
• Operate and maintain laboratory equipment, including cross-section preparation tools, optical microscopes, and SEM systems.
• Document inspection results, observations, and analysis findings accurately.
• Prepare technical reports detailing inspection results and material characterization findings.
• Communicate analysis results and technical findings to engineers and project stakeholders.

Requirements

• Minimum Diploma in Engineering, Materials Science, Electronics, or a related field.
• 2 years or more of hands-on experience in semiconductor package sample preparation, mounting, grinding, polishing, and cross-sectioning.
• Experience operating optical microscopes and SEM equipment.
• Experience in image analysis, metrology, and technical reporting software.
• Ability to identify and document defects, including voids, cracks, contamination, and delamination.
• Familiarity with semiconductor packaging and PCB manufacturing processes.
• Strong attention to detail, analytical thinking, and technical documentation skills.
• Ability to work independently and collaborate effectively with engineering teams.

Future Skill Development Opportunities (On-the-Job Training)

• Learn AI-assisted tools for report generation and test result documentation.
• Assist in managing largedatasets and performing trend analysis for process monitoring.
• Collaborate with engineers on machine vision and AI-based defect detection projects.

EA License No: 13C6655
EA Reg No: R1109557 Rose