Head of Device Fabrication, Advanced Packaging and Assembly

Universal Quantum Ltd.; Singapore; Sur place; SGD 250 000 - 420 000; Plein temps

Résumé du poste

Universal Quantum is seeking a Head of Device Fabrication, Advanced Packaging and Assembly to lead the development, industrialisation and delivery of foundry processes, advanced packaging and assembly for quantum processors. Based in Singapore, this role oversees teams across Singapore and Japan and partners with foundries and suppliers to deliver scalable manufacturing solutions.

You will own the R&D roadmap from concept to production, ensure quality and compliance, and collaborate with Systems

Qualifications

• Degree (or equivalent) in Semiconductor Engineering or related field.
• Proven track record leading multidisciplinary technical teams.
• Experience in semiconductor process development, packaging, or device industrialisation in foundry/OSAT.
• Strong cross-functional collaboration across design, product and systems teams.
• Experience with multi-site or international environments.

Responsabilités

• Define and deliver the roadmap, standards, and investment priorities for quantum processor fabrication, packaging, assembly, and test.
• Lead global team of engineers across Singapore and Japan.
• Develop and optimise foundry processes end-to-end from concept through to production.
• Drive advanced packaging and interconnect solutions.
• Manage strategic supplier and partner relationships with foundries, OSATs, and technology partners.
• Own R&D programmes from concept to qualification, balancing short-term delivery with long-term development.
• Ensure qualification and manufacturing readiness through robust processes.

Connaissances

Technology leadership

Global team leadership

Foundry process development

Advanced packaging

Supply chain partnerships

R&D ownership

Process qualification

Cross-functional collaboration

Program delivery

Quality and compliance

Formation

Degree in Semiconductor Engineering

Description du poste

At Universal Quantum, we are building the next generation of quantum computers - machines capable of solving problems once thought impossible. Our technology has the potential to transform industries from healthcare to aerospace, materials science, and beyond. As we scale from breakthrough R&D to global delivery, resilient execution becomes as critical as technical innovation.

The Head of Device Fabrication, Advanced Packaging and Assembly is accountable for the development, industrialisation, and delivery of foundry processes, advanced packaging, and assembly technologies for quantum processors.

Based in Singapore, the role leads a global organisation across Singapore and Japan and manages strategic relationships with semiconductor foundries, outsourced semiconductor assembly and test providers, and specialist package and materials suppliers. The position combines deep technical leadership, external partner management, organisational development, and programme delivery. It owns the research and development roadmap from early process concepts through qualified, repeatable manufacturing solutions, ensuring close alignment with Systems Engineering, Device Design, Product, and Architecture teams.
What You’ll Accomplish

• Technology strategy and leadership: Define and deliver the roadmap, standards, and investment priorities for quantum processor fabrication, packaging, assembly, and test.
• Global team leadership: Build, lead, and develop a high-performing team of engineers, scientists, technical specialists, and managers, across Singapore and Japan.
• Foundry process development: Lead the development and optimisation of foundry processes, from concept through to production.
• Advanced packaging and assembly: Drive the development and industrialisation of advanced packaging, assembly, bonding, and interconnect solutions.
• Supply Chain partnerships: Build and manage strategic relationships with foundries, suppliers, and technology partners.
• Research and development ownership: Own R&D programmes for foundry, assembly, and packaging technology. Balancing short-term delivery with long-term technology development.
• Process qualification and manufacturing readiness: Establish qualification and control processes to ensure scalable, reliable manufacturing.
• Cross-functional execution: Partner with engineering, design, product, and architecture teams to translate device and system requirements into manufacturable process, package, assembly, interface, and verification specifications.
• Programme and delivery responsibility: Maintain integrated development plans, budgets, suppliers, risks and performance measures so fabrication, packaging, and assembly programmes achieve agreed scope, quality, and timeline objectives.
• Quality, reliability, safety, and compliance: Ensure process and package technologies meet applicable quality, reliability, safety, export-control, regulatory, and contractual requirements.

To be successful in this role, you must have:

• Degree (or equivalent experience) in Semiconductor Engineering, Materials Science, Physics, Microelectronics, Mechanical Engineering, Chemical Engineering, or a related technical discipline.
• Demonstrated success leading and developing multidisciplinary technical teams, including senior engineers, specialists, and managers.
• Significant experience leading semiconductor process development, advanced packaging, assembly, or device industrialisation within a foundry, IDM, OSAT, deep-tech, or similar environment.
• Proven track record of taking process and technology development from concept through qualification, yield improvement, supplier transfer, and production readiness.
• Strong technical expertise across several areas such as microfabrication, wafer processing, lithography, deposition, etch, wafer bonding, die attach, interconnects, packaging, metrology, reliability, or failure analysis.
• Experience selecting, managing, and developing relationships with foundries, OSATs, suppliers, and external manufacturing partners.
• Experience working across multiple functions, partnering with design, ASIC, systems engineering, product, and architecture teams to deliver manufacturable solutions.
• Proven ability to lead in complex, multi-site or international environments.

It would also be desirable, if you have:

• Experience leading teams or supplier networks across Singapore, Japan, or the wider Asia-Pacific semiconductor ecosystem.
• Experience with quantum processors, trapped-ion devices, MEMS, photonics, compound semiconductors, heterogeneous integration, or other complex device platforms.
• Strong understanding of technical contracts, intellectual property protection, quality systems, supply chain risk management, cost control, and development governance.

Joining Universal Quantum means becoming part of a rapidly growing company at the forefront of one of the world's most exciting technologies. As we continue to scale, you'll have the opportunity to shape the future of both our products and our organisation, taking on meaningful challenges with real impact. We offer an environment where talented people can grow their careers, broaden their expertise, and help solve some of the toughest engineering problems in the industry, all whilst working alongside world-class scientists and engineers.

We are committed to nurturing diversity and inclusion At Universal Quantum, we’re passionate about working with and for all kinds of minds. We are committed to building an inclusive environment where everyone can thrive, and we hold ourselves accountable through continuous improvement, transparency, and the way we design our hiring and working practices. We welcome team members from all backgrounds and actively work to ensure everyone can flourish.