Global Head of Quantum Foundry & Advanced Packaging

Universal Quantum Ltd.

Singapore

On-site

SGD 250,000 - 420,000

Full time

14 days+

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Job summary

Universal Quantum is seeking a Head of Device Fabrication, Advanced Packaging and Assembly to lead the development, industrialisation and delivery of foundry processes, advanced packaging and assembly for quantum processors. Based in Singapore, this role oversees teams across Singapore and Japan and partners with foundries and suppliers to deliver scalable manufacturing solutions.

You will own the R&D roadmap from concept to production, ensure quality and compliance, and collaborate with Systems

Qualifications

Degree (or equivalent) in Semiconductor Engineering or related field.
Proven track record leading multidisciplinary technical teams.
Experience in semiconductor process development, packaging, or device industrialisation in foundry/OSAT.
Strong cross-functional collaboration across design, product and systems teams.
Experience with multi-site or international environments.

Responsibilities

Define and deliver the roadmap, standards, and investment priorities for quantum processor fabrication, packaging, assembly, and test.
Lead global team of engineers across Singapore and Japan.
Develop and optimise foundry processes end-to-end from concept through to production.
Drive advanced packaging and interconnect solutions.
Manage strategic supplier and partner relationships with foundries, OSATs, and technology partners.
Own R&D programmes from concept to qualification, balancing short-term delivery with long-term development.
Ensure qualification and manufacturing readiness through robust processes.