Front End Central Product Integration (FE CPIE) MTS (FE)

Micron Technology; Singapore; On-site; SGD 80,000 - 120,000; Full time

Job summary

Micron Technology in Singapore is seeking an experienced professional in process integration for critical modules. The role requires significant expertise in semiconductor fabrication processes, with at least 7 years of industry experience. Candidates should possess strong problem-solving, data-driven decision-making, and leadership skills alongside a relevant degree. The position emphasizes teamwork and the ability to travel for face-to-face collaboration across Micron sites.

Qualifications

• Bachelor's/Master's/PhD in relevant field or 10+ years of experience in semiconductor.
• More than 7 years of relevant industry experience.
• Knowledge of Semiconductor Fabrication process flows and device performance.
• Ability to troubleshoot and solve structure and device-related issues.
• Good organizational capabilities and ability to work effectively.
• Strong teamwork skills with a focus on team dynamics.

Responsibilities

• Lead process integration for critical modules ensuring yield and quality.
• Develop root cause analysis frameworks for diagnosing non-uniformity.
• Own product integration programs and maintain technical expertise.
• Drive global alignment by leading projects and optimising processes.

Skills

Logical thinking

Data-driven decision making

Model-based problem solving

Strong interpersonal skills

Multi-tasking

Verbal and written communication skills

Education

Bachelor's/Master's/PhD in EE, Materials Engineering, Materials Science, Physics or Chemical

Job description

Job Responsibilities

• Lead process integration (PI) structural uniformity and cross‑loop integration for critical modules (e.g., capacitance loop), owning end‑to‑end integration strategies to resolve yield, quality, and reliability gaps. Drive physics‑ and process‑based integration solutions through close collaboration with cross‑module process owners, PI subject‑matter experts, and key suppliers to optimise integration structures and achieve BIC yield and quality targets.
• Develop and apply model‑based root cause analysis frameworks (transport, reaction kinetics, pattern density, and geometry‑dependent effects) to diagnose structural non‑uniformity. Define, implement, and continuously strengthen critical inline monitoring and defence lines (CD, film loss, mass delta, defectivity, edge/periphery metrics) to ensure robust control of structural uniformity.
• Own and advance product integration programs and loop‑level domain expertise, maintaining deep technical knowledge across node transitions. Proactively drive node‑over‑node “shift‑left” integration, including early implementation of uniformity, bevel, and backside best‑known‑methods (BKMs) during development phases to accelerate whole‑wafer (centre‑to‑edge) yield and quality ramp.
• Drive worldwide technical alignment and execution excellence by leading global projects, standardising and leveraging network BKMs, and scaling proven solutions across sites. Identify efficiency and performance gaps, and lead business process creation, optimisation, and re‑engineering to improve benchmark performance, cycle time, and development productivity.

Job Requirements

• Bachelor's/Master's/PhD. in EE, Materials Engineering, Materials Science, Physics and Chemical but optional if candidates have more than 10 years' experience in process related role in the semiconductor industry.
• With more than 7 years of relevant industry experience/knowledges.
• Good logical thinking and knowledge in Semiconductor Fabrication process flows, interaction of different processes and how changes affect yield, device performance and reliability. Understanding of DRAM and NAND operation and structure to decipher parametric, probe and qual data from both front‑end and backend assembly processes.
• Good model‑based problem solving, together with data‑driven decision making, and presentation skills. Proven ability to troubleshoot and solve structure and device‑related issues, and address root cause.
• Good organisational capabilities and ability to work effectively. Ability to be flexible with job responsibilities and take the initiative to assume added responsibilities. Travel to Micron sites as necessary for face‑to‑face collaboration.
• Strong interpersonal skills and customer/co‑worker relationships. Successfully demonstrated teamwork skills with a strong focus on developing good team dynamics.
• Good multi‑tasking, verbal and written communication skills.

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.