Front End Central Product Integration Engineer – Test & Product Yield Integration (Senior / Sta[...]

Micron Technology; Singapore; On-site; SGD 90,000 - 150,000; Full time

Job summary

Micron Technology in Singapore is seeking a leader for global Product Integration initiatives. This role involves improving yield and quality across technology nodes and products, and executing strategies to ensure Packaging Technology development aligns with product qualifications. The ideal candidate should have deep knowledge in device architecture and manufacturing processes, with the ability to foster innovation by resolving yield and quality challenges across teams.

Qualifications

• Deep knowledge of device architecture and physics.
• Experience with product design, operation, and packaging interactions.
• Understanding of end-to-end test flow and manufacturing processes.

Responsibilities

• Lead and drive global Product Integration initiatives.
• Centralize project information and drive execution to closure.
• Promote Best-Known-Method development and standardization.

Job description

Our vision is to transform how the world uses information to enrich life for all.

Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities.

Key Responsibilities

• Lead and drive global Product Integration initiatives to improve yield, quality, and benchmark performance across technology nodes and products.
• Centralize and synthesize project information (design requirements, test challenges, yield learning) from multiple global teams and drive execution to closure.
• Drive yield breakthroughs by understanding the end‑to‑end test flow, product design and operation, packaging interactions, and manufacturing processes while balancing yield vs reliability requirements.
• Foster technical innovation by characterizing device failure modes using deep knowledge of device architecture, physics, packaging interaction, and available test/process knobs.
• Define and drive strategies to ensure Packaging Technology and Chip‑Package Interaction are developed and qualified ahead of product qualification.
• Lead cross‑functional and cross‑site taskforces (Product, Test, Yield, Design, Fab, Packaging, Quality, TD) to resolve yield and quality challenges in a timely manner.
• Promote network Best‑Known‑Method (BKM) development, standardization, and business process creation or re‑engineering to improve productivity and efficiency.
• Maintain strong working relationships with stakeholders in Fab, Technology Development, Product Engineering, Test Engineering, Quality, and Packaging teams.
• Communicate project status, risks, and proposals effectively through clear written reports and technical presentations.
• Proactively identify obstacles, elevate when needed, and partner with management to drive successful outcomes.
• Travel to Micron fab and development sites as needed to support project execution and alignment.

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.