Job Responsibilities
- Lead process integration (PI) structural uniformity and cross-loop integration for critical modules (e.g., capacitance loop), owning end-to-end integration strategies to resolve yield, quality, and reliability gaps.
- Drive physics- and process-based integration solutions through close collaboration with cross-module process owners, PI subject-matter experts, and key suppliers to optimise integration structures and achieve BIC yield and quality targets.
- Develop and apply model-based root cause analysis frameworks (transport, reaction kinetics, pattern density, and geometry-dependent effects) to diagnose structural non-uniformity.
- Define, implement, and continuously strengthen critical inline monitoring and defence lines (CD, film loss, mass delta, defectivity, edge/periphery metrics) to ensure robust control of structural uniformity.
- Own and advance product integration programs and loop-level domain expertise, maintaining deep technical knowledge across node transitions.
- Proactively drive node-over-node “shift-left” integration, including early implementation of uniformity, bevel, and backside best-known methods (BKMs) during development phases to accelerate whole-wafer (centre-to-edge) yield and quality ramp.
- Drive worldwide technical alignment and execution excellence by leading global projects, standardising and leveraging network BKMs, and scaling proven solutions across sites.
- Identify efficiency and performance gaps, and lead business process creation, optimisation, and re-engineering to improve benchmark performance, cycle time, and development productivity.
Job Requirements
- Bachelor's/Master's/PhD in EE, Materials Engineering, Materials Science, Physics, or Chemistry, or more than 10 years of experience in a process-related role in the semiconductor industry.
- More than 7 years of relevant industry experience and knowledge.
- Good logical thinking and knowledge in semiconductor fabrication process flows, interaction of different processes, and how changes affect yield, device performance, and reliability.
- Understanding of DRAM and NAND operation and structure to decipher parametric, probe and qual data from both front-end and backend assembly processes.
- Good model-based problem solving, data-driven decision making, and presentation skills.
- Proven ability to troubleshoot and solve structure- and device-related issues, and address root cause.
- Good organisational capabilities and ability to work effectively.
- Ability to be flexible with job responsibilities and take the initiative to assume added responsibilities.
- Travel to Micron sites as necessary for face-to-face collaboration.
- Strong interpersonal skills and customer/co-worker relationships.
- Successfully demonstrated teamwork skills with a strong focus on developing good team dynamics.
- Good multi-tasking, verbal and written communication skills.
About Micron Technology, Inc.
Micron Technology, Inc. is an industry leader in innovative memory and storage solutions. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron and Crucial brands. The innovations our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications.
To learn more, visit micron.com/careers.
Application & Support
All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.
To request assistance with the application process and/or for reasonable accommodations, please contact hrsupport_sg@micron.com.
Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.
Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.