Extreme-Environment Hardware Engineer (Mechatronics)

NANYANG TECHNOLOGICAL UNIVERSITY; Singapore; On-site; SGD 60,000 - 90,000; Full time

Job summary

NANYANG TECHNOLOGICAL UNIVERSITY's CARTIN invites applications for a hardware-focused Research Associate to design and prototype a compact, heat-resistant multi-sensor payload. The system must withstand 250°C for 10 minutes without external cooling and keep internal electronics below 55°C.

Responsibilities include designing compact mechanical housing for 250°C ambient conditions, integrating miniaturized components, performing heat simulations, and testing in harsh environments.

Qualifications

• Bachelor or Master in Mechanical Engineering, Mechatronics, or similar.
• Strong experience in heat-resistant enclosure design and miniaturized hardware integration.
• Familiar with thermal simulation tools (ANSYS, SolidWorks, etc.).
• Experience with IP65/IP67 standards, fanless computing, and embedded design.

Responsibilities

• Design compact mechanical housing to operate under 250°C ambient conditions.
• Ensure internal core temperature remains under 55°C during runtime.
• Select and integrate miniaturized components (compute, battery, sensors).
• Strip sensor casings and reassemble into a custom mount with thermal shielding.
• Perform heat simulation, thermal insulation, and shock-resistance design.
• Test hardware in specified sites and environments.

Skills

Heat-resistant enclosure design

Miniaturized hardware integration

Thermal management

Embedded design

Mechanical CAD

Education

Bachelor or Master in Mechanical Engineering/Mechatronics

Tools

ANSYS

SolidWorks

Job description

NANYANG TECHNOLOGICAL UNIVERSITY's CARTIN invites applications for a hardware-focused Research Associate to design and prototype a compact, heat-resistant multi-sensor payload. The system must withstand 250°C for 10 minutes without external cooling and keep internal electronics below 55°C.

Responsibilities include designing compact mechanical housing for 250°C ambient conditions, integrating miniaturized components, performing heat simulations, and testing in harsh environments.