Engineer, Product Engineering (Media Health Reliability), Heteregenous Integration - High Bandwidth Memory

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.; Singapore; On-site; SGD 90,000 - 130,000; Full time

Job summary

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD. is seeking a detail-oriented reliability engineer to define and execute test flows and qualification plans for product reliability.

The role focuses on reducing DPM and improving yield through cross-functional collaboration with Fab, HBM Technology Development, and Quality teams. You will debug and identify root causes using EFA/PFA, drive process conversions to optimize cost and reliability, and mentor junior engineers while promoting an AI-first

Qualifications

• Bachelor’s or Master’s degree in Electrical and Electronics Engineering or a related field.
• Experience in semiconductor devices, circuit design, or product validation is a plus.
• Solid understanding of problem-solving methodologies with root-cause analysis.
• Familiarity with CMOS technology, DRAM architecture, and basic device physics.
• Exposure to data analysis, statistics, and scripting tools such as Python or JMP.
• Strong attention to detail and commitment to quality.
• Ability to work effectively in team-based projects and contribute to shared goals.
• Flexible and eager to learn, with willingness to take on diverse roles in a dynamic engineering environment.
• Responsible and accountable with professional work ethic and ownership.
• Clear and effective communication, especially for technical findings.

Responsibilities

• Reliability Test Flow Development: Define and develop reliability stress, test flows, and test plans.
• Reliability Test Plan and Execution: Define qualification plan and manage execution progress.
• DPM reduction: Drive down Extrinsic and Intrinsic Reliability through optimized test flows.
• Root Cause and Resolution of Qual and RMA Device Issues: Debug and identify root causes via EFA and PFA.
• Process Conversions and HVM: Provide recommendations to fab teams for new process conversions.
• Risk Management: Communicate with Product Managers to manage risks in conversions.
• Promotion of Innovation: Promote AI/automation to gain a technical edge.
• Mentorship and Development of Others: Develop and mentor team members.
• Project Management: Ensure timely and efficient project execution.
• Technical Decision Making: Make final decisions on risk analysis and priorities.
• Cross-Functional Collaboration: Collaborate with Fab, HBM Tech Development, HBM Design, System Development, and Quality/Reliability teams.
• AI-First Mindset & Mentorship: Embed AI into reliability workflows as standard practice.

Skills

Root cause analysis

Data analysis

Python scripting

Team collaboration

Project management

Mentorship

Quality mindset

Problem solving

Communication

AI/automation mindset

Education

Bachelor’s or Master’s in Electrical & Electronics Engineering or related

Tools

Python

JMP

Job description

Responsibilities:

• Reliability Test Flow Development:Define and develop reliability stress, test flows and test plans to cover all Product Reliability aspects.

• Reliability Test Plan and Execution:Work closely with Global Quality team to define qualification plan, review and manage the qualification execution progress, and drive for qualification gating issue resolution.

• DPM reduction: Drive down and achieving Extrinsic Reliability (Time 0 and Field DPM) and Intrinsic Reliability through Optimized Manufacturing Test Flows and Test Strategy to meet critical KPI’s Quality, Cost and Cycle Time

• Root Cause and Resolution of Qual and RMA Device Issuespertaining to defectivity and intrinsic reliability: Debug and identify root cause and failures in reliability tests by electric failure analysis(EFA) and Physical Failure Analysis (PFA) and drive for resolution and improvements through cross functional team collaboration.

• Process Conversions and HVM:The role involves providing recommendation to fab teams for new process conversions to reduce cost, increase yields. This is critical as it directly impacts the yield, quality, reliability, and performance of HBM products, which are key components in many modern technologies.

• Risk Management:The role requires communication with Product Managers/Leads to manage risks associated with DPM process conversions. This is crucial in ensuring that the conversions move at an appropriate pace, balancing the need for innovation with the need for stability and reliability.

• Promotion of Innovation:The role involves promoting innovation and driving for changes that will provide Micron with a technical advantage over its competition. This is vital for maintaining Micron’s competitive edge in the market.

• Mentorship and Development of Others:The role involves actively developing and mentoring others. This is important for the growth and development of the team and the organization.

• Project Management:Developing project management skills within the team ensures efficient execution of projects, leading to timely delivery of technological solutions.

• Technical Decision Making:The role involves making final decisions on risk analysis and project prioritization. These decisions directly impact the direction of technological development.

• Cross-Functional Collaboration:This role necessitates collaboration with various cross-functional teams such as Fab, HBM Technology Development, HBM Design, System Development, and Quality/Reliability team. This collaboration is vital for the holistic development and shipping of end products.

• AI-First Mindset & Mentorship: Actively engage and leverage Artificial Intelligence; embed AI/automation into reliability workflows as a standard practice, aligned with Micron's AI-first productivity direction.

Requirements

• Bachelor’s or Master’s degree inElectrical and Electronics Engineeringor a related field.

• Experience insemiconductor devices,circuit design, orproduct validationis a plus.

• Solid understanding ofproblem-solving methodologies, with a focus on identifying root causes and exploring solution spaces.

• Familiarity withCMOS technology,DRAM architecture, and basicdevice physics.

• Exposure todata analysis,statistics, and scripting tools such as Python or JMP.

• Strong attention to detail and a commitment to quality.

• Ability to work effectively inteam-based projects, contributing to shared goals and outcomes.

• Flexible and eager to learn, with a willingness to take on diverse roles in a dynamic engineering environment.

• Responsible and accountable, with a professional work ethic and ownership of assigned tasks.

• Clear and effective communication skills, especially when articulating technical concepts and findings