Principal Engineer, HIG-HBM Product Engineering (Media Health Reliability)

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE LTD

Singapore

Sur place

SGD 200 000 - 260 000

Plein temps

Il y a 37 heures
Soyez parmi les premiers à postuler

Obtenez une réponse de cet employeur

Votre CV et votre lettre de motivation, adaptés exactement à ce que l’employeur recherche.

Passez les filtres ATS

Résumé du poste

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE LTD is seeking an experienced senior leader for HBM Product Engineering Media Health to drive reliability test development and execution for Micron’s latest HBM products. You will lead a high-performing team, tackle defectivity and intrinsic reliability, and optimize manufacturing test flows to achieve key KPI targets.

The role emphasizes cross-functional collaboration across Fab, TD, GQ, and Quality/Reliability teams, with a focus on AI-enabled

Qualifications

  • Bachelor’s or Master’s degree in Electrical and Electronics Engineering or related field.
  • Strong reliability and test development background in semiconductors.
  • Experience with DRAM/CMOS and device physics is a plus.
  • Exposure to data analysis and scripting tools such as Python or JMP.

Responsabilités

  • Develop reliability stress tests, plans, and flows for product reliability.
  • Define qualification plan with Global Quality and drive gating issue resolution.
  • Drive extrinsic and intrinsic reliability improvements to meet KPI targets.
  • Lead root cause analysis for Qual and RMA failures using EFA and PFA.
  • Provide recommendations on new process conversions to reduce cost and improve yield.
  • Manage risks with Product Managers/Leads during DPM conversions.
  • Promote innovation and AI-driven reliability improvements across teams.
  • Mentor and develop team members; drive project delivery and collaboration.

Connaissances

Reliability testing
Cross-functional leadership
AI/ML usage in reliability
Python scripting

Formation

Bachelor’s or Master’s in Electrical and Electronics Engineering or related field

Outils

Python
JMP

Description du poste

Our vision is to transform how the world uses information to enrich life for all.

Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.

As a key leader within High Bandwidth Memory (HBM) Product Engineering Media Health team, you will spearhead and develop a high performing team driving both intrinsic and extrinsic reliability test development and execution for Micron’s latest HBM products, both on DRAM and Interface die and a stacked product. Your responsibility is to drive extrinsic DPM reduction (Time 0 and Field DPM) and lead the intrinsic reliability charter, along with optimized Manufacturing Test Flow to meet critical KPI’s Quality, Cost and Cycle Time. You will be leading the team to characterize the products from reliability aspect, identify the reliability gaps, working on root cause and resolution of qual and RMA failures pertaining to defectivity and intrinsic reliability margin and drive fab process improvement driven by the qual failures. Additionally, your team will also be the key person in frontend process conversion, where you will work with Fab, TD, GQ teams to establish robust business process for process conversions to facilitate yield improvements, DPM and Cost Reduction. You will collaborate across functions within and outside of HBM to meet both strategic and tactical objectives while continually maximizing the effectiveness of the HIG HBM PE organization. The future of HBM are exciting and dynamics. Micron is seeking experienced individuals that find technical challenges engaging and invigorating.

Responsibilities:
  • Reliability Test Flow Development: Define and develop reliability stress, test flows and test plans to cover all Product Reliability aspects.
  • Reliability Test Plan and Execution: Work closely with Global Quality team to define qualification plan, review and manage the qualification execution progress, and drive for qualification gating issue resolution.
  • DPM reduction: Drive down and achieving Extrinsic Reliability (Time 0 and Field DPM) and Intrinsic Reliability through Optimized Manufacturing Test Flows and Test Strategy to meet critical KPI’s Quality, Cost and Cycle Time
  • Root Cause and Resolution of Qual and RMA Device Issues pertaining to defectivity and intrinsic reliability: Debug and identify root cause and failures in reliability tests by electric failure analysis(EFA) and Physical Failure Analysis (PFA) and drive for resolution and improvements through cross functional team collaboration.
  • Process Conversions and HVM: The role involves providing recommendation to fab teams for new process conversions to reduce cost, increase yields. This is critical as it directly impacts the yield, quality, reliability, and performance of HBM products, which are key components in many modern technologies.
  • Risk Management: The role requires communication with Product Managers/Leads to manage risks associated with DPM process conversions. This is crucial in ensuring that the conversions move at an appropriate pace, balancing the need for innovation with the need for stability and reliability.
  • Promotion of Innovation: The role involves promoting innovation and driving for changes that will provide Micron with a technical advantage over its competition. This is vital for maintaining Micron’s competitive edge in the market.
  • Mentorship and Development of Others: The role involves actively developing and mentoring others. This is important for the growth and development of the team and the organization.
  • Project Management: Developing project management skills within the team ensures efficient execution of projects, leading to timely delivery of technological solutions.
  • Technical Decision Making: The role involves making final decisions on risk analysis and project prioritization. These decisions directly impact the direction of technological development.
  • Cross-Functional Collaboration: This role necessitates collaboration with various cross-functional teams such as Fab, HBM Technology Development, HBM Design, System Development, and Quality/Reliability team. This collaboration is vital for the holistic development and shipping of end products.
  • AI Strategy for Reliability: Identify and scope high-leverage AI use cases by using Claude code, agentic AI etc in product qualifications; partner with internal teams to pilot and productionize solutions.
  • Applied Machine Learning: Proficient in applying machine learning (regression, classification, anomaly detection, clustering) and AI assisted tools to reliability datasets to segment fails, outliers etc.
  • AI-First Mindset & Mentorship: Actively coach engineers on AI adoption; embed AI/automation into reliability workflows as a standard practice, aligned with Micron's AI-first productivity direction.
Requirements
  • Bachelor’s or Master’s degree inElectrical and Electronics Engineeringor a related field.
  • 10+ years in semiconductor industry with product, testing, or reliability experience.
  • Coursework or internship experience insemiconductor devices,circuit design, orproduct validationis a plus.
  • Solid understanding ofproblem-solving methodologies, with a focus on identifying root causes and exploring solution spaces.
  • Familiarity withCMOS technology,DRAM architecture, and basicdevice physics.
  • Exposure todata analysis,statistics, and scripting tools such as Python or JMP.
  • Strong attention to detail and a commitment to quality.
  • Ability to work effectively inteam-based projects, contributing to shared goals and outcomes.
  • Flexible and eager to learn, with a willingness to take on diverse roles in a dynamic engineering environment.
  • Responsible and accountable, with a professional work ethic and ownership of assigned tasks.
  • Clear and effective communication skills inwritten and spoken English, especially when articulating technical concepts and findings
About Micron Technology, Inc.

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich lifefor all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.

To learn more, please visit micron.com/careers

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.

Obtenez votre examen gratuit et confidentiel de votre CV.

ou faites glisser et déposez votre fichier ici.

Similar jobs

Postes similaires à comparer

Staff Engineer, HIG-HBM Product Engineering (Media Health Reliability)
Staff Engineer, HIG-HBM Product Engineering (Media Health Reliability)

Micron Technology, Inc. • Singapore

Sur place
SGD 120 000 - 180 000
Principal Engineer, HIG-HBM Product Engineering (Media Health Reliability)
Principal Engineer, HIG-HBM Product Engineering (Media Health Reliability)

Micron Technology, Inc. • Singapore

Sur place
SGD 180 000 - 320 000
Engineer, HIG HBM
Engineer, HIG HBM

Micron Technology, Inc. • Singapore

Sur place
SGD 180 000 - 280 000
Senior Engineer, HIG-HBM Product Engineering (Media Health Reliability)
Senior Engineer, HIG-HBM Product Engineering (Media Health Reliability)

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE LTD • Singapore

Sur place
SGD 120 000 - 170 000
Engineer/Senior Engineer, Product & System Engineering (Media Health Reliability), Heteregenous Integration - High Bandwidth Memory
Engineer/Senior Engineer, Product & System Engineering (Media Health Reliability), Heteregenous Integration - High Bandwidth Memory

Micron Technology, Inc. • Singapore

Sur place
SGD 120 000 - 180 000
Engineer, HIG-HBM Product System & Engineering (Media Health Reliability Coding)
Engineer, HIG-HBM Product System & Engineering (Media Health Reliability Coding)

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE LTD • Singapore

Sur place
SGD 150 000 - 190 000
Senior Engineer, HIG-HBM Product Engineering (Media Health Reliability)
Senior Engineer, HIG-HBM Product Engineering (Media Health Reliability)

Micron Technology, Inc. • Singapore

Sur place
SGD 180 000 - 260 000
Engineer, Product Engineering (Media Health Reliability), Heteregenous Integration - High Bandwidth Memory
Engineer, Product Engineering (Media Health Reliability), Heteregenous Integration - High Bandwidth Memory

Micron Technology • Singapore

Sur place
SGD 90 000 - 130 000
Senior/Staff/Principal Engineer, HIG-HBM Product System & Engineering (Media Health Reliability)
Senior/Staff/Principal Engineer, HIG-HBM Product System & Engineering (Media Health Reliability)

Micron Technology, Inc. • Singapore

Sur place
SGD 90 000 - 150 000
Senior Manager, HIG HBM Product System Engineering (Media Health Manufacturing)
Senior Manager, HIG HBM Product System Engineering (Media Health Manufacturing)

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE LTD • Singapore

Sur place
SGD 180 000 - 260 000