Engineer, Product Engineering, Media Health Manufacturing, HIG-HBM

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.; Singapore; On-site; SGD 90,000 - 150,000; Full time

Job summary

Micron Semiconductor Asia Operations Pte. Ltd. is seeking a key technical contributor for the High Bandwidth Memory (HBM) Product Engineering – Media Health team.

You will drive Media Health manufacturing execution for Micron’s next-generation HBM products, owning core KPIs of quality, cost, cycle time and scale. You will develop and validate test flows, improve yields, and deliver optimized reliability through advanced circuit debugging and test strategies.

Qualifications

• Bachelor’s or Master’s degree in Electrical and Electronics Engineering or related field.
• Experience in semiconductor devices, circuit design, or product validation.
• Solid problem-solving methodologies and root-cause analysis.
• Familiarity with CMOS technology, DRAM architecture, and basic device physics.
• Exposure to data analysis, statistics, and scripting (Python or JMP).
• Strong attention to detail and commitment to quality.
• Ability to work effectively in team-based projects.
• Flexible and eager to learn with a proactive mindset.
• Professional work ethic and ownership of tasks.
• Clear written and spoken English communications.

Responsibilities

• Optimized test coverage on current and future HBM design architectures and process nodes.
• Develop, validate, characterize, and qualify Micron’s next-generation HBM products.
• Support design verification and in-depth circuit analysis using CAD tools and Verilog simulations.
• Improve manufacturing test yields and reduce test time; address yield-related issues.
• Root cause analysis and resolution of manufacturing test flow issues, qual and RMA devices.
• Promote innovation and drive for technical advantages over competition.
• Mentor and develop other team members.
• Develop project management skills within the team for timely delivery.
• Make technical decisions on risk analysis and project prioritization.
• Collaborate with Fab, HBM Technology Development, HBM Design, System Development, and Quality/Reliability teams.
• Leverage AI-powered tools and automation to enhance productivity and efficiency.

Skills

Semiconductor devices

Circuit design

Product validation

Data analysis

Python

JMP

Teamwork

Problem solving

Communication

Education

Bachelor’s or Master’s degree in Electrical and Electronics Engineering or related field

Tools

Verilog simulations

CAD tools

Job description

As a key technical contributor within the High Bandwidth Memory (HBM) Product Engineering – Media Health team, you will play a critical role in driving Media Health manufacturing execution for Micron’s latest next‑generation HBM products, including DRAM die, interface die, and stacked HBM solutions. You will be responsible for Best‑in‑Class HBM product enablement, with direct technical ownership across the core manufacturing KPIs of Quality, Cost, Cycle Time, and Scale. Your contributions will include manufacturing test flow development and validation, device‑and‑stack‑level yield improvement, and delivery of optimized extrinsic and intrinsic reliability through deep circuit debug, test coverage optimization, and innovative test strategies. In this role, you will drive manufacturing test time reduction, enhance overall manufacturing efficiency, and contribute to Design‑For‑Test (DFT) strategy development, introducing new ideas that improve cost competitiveness, cycle time, and product quality. You will work closely with cross‑functional partners—including Fab, Product Leads, Design Engineering, Technology Development, and Test Solutions Engineering—to execute both strategic initiatives and tactical deliverables, ensuring continued technology and product leadership. The future of HBM is fast‑moving and dynamic. Micron is seeking experienced technical professionals who are energized by complex engineering challenges, thrive in collaborative environments, and are motivated to shape the next generation of HBM product and manufacturing innovation.

Responsibilities:

• Optimized Test Coverage: The responsibility of ensuring optimized test coverage on all current and future HIG HBM design architectures and process nodes is a technical aspect of this role. This is crucial for maintaining the effectiveness and efficiency in high-volume manufacturing.

• Product Development and Validation: This role is pivotal in developing, validating, characterizing, and qualifying Micron’s next‑generation HBM products. Ensuring that these products are reliable and meet the necessary standards is a technical task that directly impacts the market readiness of the products.

• Support for New Product Design Validation: The role provides support for design verification and in‑depth circuit of new products using CAD tools and Verilog simulations. This technical support is crucial for the development of new products and technologies.

• Yield Improvement and Cost Reduction:The role involves technical tasks like improving manufacturing test yields (Specifically related to Device Issues from the DRAM, Interface and Stacked Die Yield), reducing test time, and resolving yield‑related issues. These activities are critical for cost reduction and meeting yield targets.

• Root Cause and Resolution of Manufacturing Test Flow Issue, Qual and RMA Device Issues

• Promotion of Innovation: The role involves promoting innovation and driving for changes that will provide Micron with a technical advantage over its competition. This is vital for maintaining Micron’s competitive edge in the market.

• Mentorship and Development of Others: The role involves actively developing and mentoring others. This is important for the growth and development of the team and the organization.

• Project Management: Developing project management skills within the team ensures efficient execution of projects, leading to timely delivery of technological solutions.

• Technical Decision Making:The role involves making final decisions on risk analysis and project prioritization. These decisions directly impact the direction of technological development.

• Cross‑Functional Collaboration:This role necessitates collaboration with various cross‑functional teams such as Fab, HBM Technology Development, HBM Design, System Development, and Quality/Reliability team. This collaboration is vital for the holistic development and shipping of end products.

• Leveraging AI ‑ powered tools and automation to enhance productivity, streamline workflows, accelerate decision‑making, and improve operational efficiency.

Requirements

• Bachelor’s or Master’s degree inElectrical and Electronics Engineeringor a related field.

• Experience insemiconductor devices,circuit design, orproduct validation.

• Solid understanding ofproblem‑solving methodologies, with a focus on identifying root causes and exploring solution spaces.

• Familiarity withCMOS technology,DRAM architecture, and basicdevice physics.

• Exposure todata analysis,statistics, and scripting tools such as Python or JMP.

• Strong attention to detail and a commitment to quality.

• Ability to work effectively inteam‑based projects, contributing to shared goals and outcomes.

• Flexible and eager to learn, with a willingness to take on diverse roles in a dynamic engineering environment.

• Responsible and accountable, with a professional work ethic and ownership of assigned tasks.

• Clear and effective communication skills inwritten and spoken English, especially when articulating technical concepts and findings