Cloud DevOps Intern: Build Scalable AWS Services

Autodesk, Inc.; Singapore; Hybrid; SGD 17,000 - 26,000; Part time

Job summary

Autodesk Singapore seeks a highly motivated DevOps Engineer intern to join our cloud services team, building and supporting the cloud ecosystem for AutoCAD products. You’ll work with Python, Django, Java, AWS, PostgreSQL/MySQL, Redis, Docker and more, in a multi-platform AutoCAD environment. On-site recruitment runs 9 Oct–6 Nov 2026.

You’ll research, design, deploy, and monitor backend features, collaborate across teams, and adopt market-standard DevOps practices to scale cloud services on AWS.

Qualifications

• Enrolled in a full-time Bachelor's program in Computer Science or Engineering or related field.
• Penultimate or final year (graduating 2027 or 2028).
• Understanding of object-oriented design, data structures and algorithms.
• DevOps and architecture methodologies.
• Knowledge of Docker environments.
• Excellent problem-solving skills and ability to work independently.

Responsibilities

• Research and recommend approaches to solve problems.
• Participate in design, development, deployment, and monitoring of cross-platform features for AutoCAD cloud services.
• Adopt best practices and market-standard technologies and methodologies.
• Collaborate with colleagues inside and outside the team.

Skills

Python

JavaScript

Docker

AWS

CI/CD

Communication

Education

Bachelor's degree in Computer Science or Engineering

Tools

Docker

Jenkins

Terraform

PostgreSQL/MySQL

Job description

Autodesk Singapore seeks a highly motivated DevOps Engineer intern to join our cloud services team, building and supporting the cloud ecosystem for AutoCAD products. You’ll work with Python, Django, Java, AWS, PostgreSQL/MySQL, Redis, Docker and more, in a multi-platform AutoCAD environment. On-site recruitment runs 9 Oct–6 Nov 2026.

You’ll research, design, deploy, and monitor backend features, collaborate across teams, and adopt market-standard DevOps practices to scale cloud services on AWS.