ATE Test Development Engineer

Avago Technologies Intl' Sales Pte Ltd; Singapore; On-site; SGD 179,000 - 256,000; Full time

Job summary

Broadcom is seeking an ATE Test Development Engineer to shape and bring up advanced test programs for next-generation networking switch ICs. You will work hands-on with Teradyne UltraFlex platforms to ensure high-yield, high-performance testing across extreme conditions, collaborating with Design, Packaging, and Production teams.

The role emphasizes architecture, debugging, data analysis, and scripting for robust test solutions that scale to multi-die CoWoS packaging and >100G SERDES interfaces.

Qualifications

• Hands-on experience with Teradyne UltraFlex testers.
• Independent development of test programs for high-speed ASICs.
• Debugging failure mechanisms with cross-functional teams.
• Volume data analysis and failure correlation with system performance.
• Programming experience for test method development.
• Understanding chip performance and test hardware contributions at ATE.
• Experience with extreme temperature testing of ASICs.

Responsibilities

• Architect and bring up ATE test programs for flagship networking switch ICs (>100G SERDES).
• Lead hardware strategy for final test and wafer probe with PCB designers and probe card suppliers.
• Hands-on silicon debug on ATE across electrical, mechanical, and thermal challenges.
• Address packaging and thermal challenges from large die sizes and CoWoS.
• Optimize test flows to improve yield and manufacturing efficiency.
• Collaborate with Product, Design, and Packaging teams to move silicon to production.
• Support production deployment with global manufacturing teams.

Skills

Test program development

Debugging complex failures

Data analysis

Scripting for test methods

Cross-functional collaboration

AI tools for test development

Education

Bachelor's degree in Electrical/Computer Engineering

Master's degree in Electrical/Computer Engineering

Tools

Teradyne UltraFlex tester platforms

Job description

Join Broadcom’s Global Operations team supporting the Core Switching Group as an ATE Test Development Engineer! In this high-impact role, you will shape the future of next-generation networking switches powering Scale-Up, Scale-Out, and Scale-Across architectures for AI and traditional cloud data centers. Based at our R&D innovation hubs in Irvine, CA or San Jose, CA, you will tackle groundbreaking engineering milestones, working hands-on with state-of-the-art Teradyne UltraFlex test platforms and cutting-edge silicon technology.

Responsibilities

• Next-Gen Test Development: Architect and bring up advanced ATE test programs for flagship networking switch ICs featuring high-speed SERDES (>100G) and cutting-edge multi-die CoWoS advanced packaging.

• Advanced Hardware Engineering: Lead the hardware strategy for final test and wafer probe, partnering with top-tier PCB designers, socket vendors, and probe card suppliers to push performance limits.

• Hands-On Silicon Debug: Drive direct, hands-on debug on ATE, conquering complex electrical, mechanical, and extreme thermal challenges as chip power approaches unprecedented 10,000W thresholds.

• Advanced Packaging & Thermal Innovation: Solve novel mechanical and structural test challenges introduced by massive die sizes and multi-die CoWoS package integration.

• Program Optimization & Yield Enhancement: Optimize test flows and reduce test time to improve yield and manufacturing efficiency while ensuring uncompromising quality.

• Cross-Functional Collaboration: Partner closely with world-class Product, Design, and Packaging Engineers to bring complex silicon from concept to high-volume production.

• Global Production Deployment: Collaborate seamlessly with manufacturing teams across Asia to release and support robust production test programs.

Skills/Experiences

• Hands-on experience with Teradyne UltraFlex tester platforms
• Must be able to independently develop test programs, including complex test flows to support chip specifications around performance and power consumption
• Must be able to support debugging/troubleshooting of various failure mechanisms with the part by working with cross-functional teams
• Ability to perform volume data analysis, Correlate failures with system failures, Proficiency with Data analysis softwares/languages
• Programming experience required for test method development
• Ability to work with test hardware development teams, able to understand chip performance at ATE and contributions from the test hardware on chip behavior
• Experienced with extreme temperature testing of ASICs at ATE
• Experience with AI tools for quick script development is a plus

Preferred

• Hands on experience with Prober, Handler, ATC
• Skills working with AI tools/models
• Usage of AI tools for test program development

Education:

Bachelor's Degree and 8+ years of related experience, or Master's Degree and 6+ years of related experience