ATE Test Development Engineer

AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED; Singapore; On-site; SGD 154,000 - 231,000; Full time

Job summary

Broadcom is seeking an ATE Test Development Engineer to design and implement state-of-the-art test programs for flagship networking switch ICs. You will work hands-on with Teradyne UltraFlex platforms, resolving complex hardware and thermal challenges while collaborating with PCB, socket, and probe card teams.

The role encompasses developing advanced test flows for high-performance SERDES and multi-die CoWoS packaging, driving yield improvements, and supporting production deployment across Asia.

Qualifications

• Hands-on experience with Teradyne UltraFlex tester platforms.
• Independent development of test programs including complex test flows.
• Ability to troubleshoot and debug failures with cross-functional teams.
• Proficiency in data analysis and correlating failures with system behavior.
• Programming experience for test method development.
• Experience with test hardware contributions to chip behavior at ATE.
• Experience with extreme temperature testing of ASICs at ATE.

Responsibilities

• Architect and bring up advanced ATE test programs for flagship networking switch ICs with high-speed SERDES (>100G).
• Lead hardware strategy for final test and wafer probe, partnering with PCB designers, socket vendors and probe card suppliers.
• Conduct hands-on silicon debug on ATE, addressing electrical, mechanical and thermal challenges as power approaches 10,000W.
• Tackle packaging/thermal challenges from large multi-die CoWoS integration.
• Optimize test flows to reduce test time, improve yield and manufacturing efficiency.
• Collaborate with Product, Design and Packaging Engineers to move silicon from concept to high-volume production.
• Coordinate with manufacturing teams across Asia to deploy robust production test programs.

Skills

Teradyne UltraFlex

Test program development

Data analysis

Hardware debugging

AI tools for test development

Education

Bachelor's Degree in EE/related field

Master's Degree in EE/related field

Tools

Teradyne UltraFlex

Job description

Join Broadcom's Global Operations team supporting the Core Switching Group as an ATE Test Development Engineer! In this high-impact role, you will shape the future of next-generation networking switches powering Scale-Up, Scale-Out, and Scale-Across architectures for AI and traditional cloud data centers. Based at our R&D innovation hubs in Irvine, CA or San Jose, CA, you will tackle groundbreaking engineering milestones, working hands-on with state-of-the-art Teradyne UltraFlex test platforms and cutting-edge silicon technology.

Responsibilities

• Next-Gen Test Development: Architect and bring up advanced ATE test programs for flagship networking switch ICs featuring high-speed SERDES (>100G) and cutting-edge multi-die CoWoS advanced packaging.
• Advanced Hardware Engineering: Lead the hardware strategy for final test and wafer probe, partnering with top-tier PCB designers, socket vendors, and probe card suppliers to push performance limits.
• Hands-On Silicon Debug: Drive direct, hands-on debug on ATE, conquering complex electrical, mechanical, and extreme thermal challenges as chip power approaches unprecedented 10,000W thresholds.
• Advanced Packaging & Thermal Innovation: Solve novel mechanical and structural test challenges introduced by massive die sizes and multi-die CoWoS package integration.
• Program Optimization & Yield Enhancement: Optimize test flows and reduce test time to improve yield and manufacturing efficiency while ensuring uncompromising quality.
• Cross-Functional Collaboration: Partner closely with world-class Product, Design, and Packaging Engineers to bring complex silicon from concept to high-volume production.
• Global Production Deployment: Collaborate seamlessly with manufacturing teams across Asia to release and support robust production test programs.

Skills/Experiences

• Hands-on experience with Teradyne UltraFlex tester platforms
• Must be able to independently develop test programs, including complex test flows to support chip specifications around performance and power consumption
• Must be able to support debugging/troubleshooting of various failure mechanisms with the part by working with cross-functional teams
• Ability to perform volume data analysis, Correlate failures with system failures, Proficiency with Data analysis softwares/languages
• Programming experience required for test method development
• Ability to work with test hardware development teams, able to understand chip performance at ATE and contributions from the test hardware on chip behavior
• Experienced with extreme temperature testing of ASICs at ATE
• Experience with AI tools for quick script development is a plus

Preferred

• Hands on experience with Prober, Handler, ATC
• Skills working with AI tools/models
• Usage of AI tools for test program development

Education

• Bachelor's Degree and 8+ years of related experience, or Master's Degree and 6+ years of related experience