Photonics Packaging Engineer

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Our international start-up client is currently seeking an Engineer with experience in the packaging of photonic and optoelectronic devices to join the R&D team. The successful candidate will be responsible for the design, assembly, and optimisation of advanced photonic packaging solutions, contributing directly to the development of next‑generation photonic systems. The ideal candidate combines strong technical expertise in photonics packaging and semiconductor assembly with excellent communication and teamwork skills, and thrives in a collaborative, cross‑functional environment. This position is suited for an engineer with some professional experience who is motivated to grow within a multidisciplinary team.

Required Skills

• Knowledge of semiconductor and photonics packaging concepts
• Familiarity with semiconductor assembly processes, including flip‑chip and wire‑bonding manufacturing flows
• Experience working in a cleanroom or precision assembly environment
• Strong verbal and written communication skills
• Master’s degree in physics, Electrical Engineering, Electronics Engineering, or related field

Please contact Rachel Anderson for further details.