Power Integrity Engineer (R&D Engineer of board / module high-current PDN)

Overview

Power Integrity Engineer (R&D Engineer of board / module high-current PDN)

Join to apply for the Power Integrity Engineer (R&D Engineer of board / module high-current PDN) role at Huawei Italy Research Centers.

About Huawei

Huawei is a leading global provider of information and communications technology (ICT) infrastructure and smart devices. We focus on telecom networks, IT, smart devices, and cloud services, aiming to create a fully connected, intelligent world. With over 200,000 employees, 55% in R&D, and operations in more than 170 countries, we invest over 20% of revenues in R&D annually, with total investments exceeding 150 billion USD in the past decade. By the end of 2023, Huawei held over 140,000 active patents.

Our Culture and Values

• Customer-centric, innovative, and committed to continuous improvement.
• Fast execution with high standards.
• Multicultural, informal, and collaborative environment.
• Ownership-driven, open to ideas, and results-oriented.

The Opportunity

We seek a talented Power Integrity Engineer to explore board-level high-current PDN technologies, electromigration, and performance evaluation of microstructures such as power planes, BGA balls, and vias.

Key Responsibilities

• Research innovative low-loss, high-current power supply architectures and improve electromigration and through-current capabilities of 1000 A+ PDNs.
• Lead board-level PDN technology development for large current and energy efficiency, supporting next-gen CPUs.
• Develop simulation and testing capabilities for electromigration of PDN microstructures under low voltage and high current.

Minimum Qualifications

• Master's degree or higher in Electrical Engineering, Computer Engineering, or Computer Science; PhD preferred.
• Experience in developing power supply systems for large chips and CPUs, with deep understanding of board-level power architecture and PDN design.
• Knowledge of simulation / testing of high-current electromigration and PCB microstructure (vias, BGA).
• Excellent communication skills and willingness to travel.
• Fluent in English.

Location

Huawei Milan Research Center, working on cutting-edge microwave and millimeter-wave communications, optical RFICs, and high-frequency technologies.

What We Offer

An exciting career in a leading multinational, with challenging work, competitive salary, and training opportunities across Europe and beyond.