Staff Process Engineer - Mold

onsemi; Lapu-Lapu; On-site; PHP 1,200,000 - 1,500,000; Full time

Job summary

onsemi in the Philippines is looking for a technical expert in transfer molding processes. The role focuses on optimizing processes, supporting new product introductions, and ensuring stable production performance. Candidates should have over 10 years of relevant experience and possess strong analytical skills.

Responsibilities include troubleshooting complex molding issues and leading continuous improvement initiatives. This position offers an opportunity to work closely with cross-functional teams to enhance product quality and production efficiency.

Qualifications

• 10+ years of experience in molding processes.
• Proven hands-on experience with transfer molding equipment.
• Strong knowledge of Epoxy Molding Compound (EMC).
• Familiarity with semiconductor package molding processes.

Responsibilities

• Optimize molding process parameters for high-quality production output.
• Diagnose and resolve molding defects through systematic troubleshooting.
• Lead root cause analysis and implement corrective actions.
• Support mold trials and New Product Introduction activities.
• Collaborate with tooling, quality, and production teams for improvements.

Skills

Process optimization

Troubleshooting complex molding issues

Lean methodologies

Six Sigma methodologies

Collaboration and communication

Education

Graduate in Mechanical, Electronics & Communications, or Chemical Engineering

Tools

Transfer molding equipment (e.g., TOWA, FUSEI)

Job description

Overview

Serve as the technical expert in transfer molding processes by driving process optimization, improving product quality, and ensuring stable and efficient production performance. The role is responsible for troubleshooting complex molding issues, supporting new product introduction, and implementing continuous improvement initiatives.

Responsibilities

• Optimize molding process parameters to ensure stable, repeatable, and high-quality production output.
• Diagnose and resolve molding defects (flash, mold bleed, package cracking, warpage) through systematic troubleshooting.
• Lead root cause analysis and implement effective corrective and preventive actions (CAPA).
• Support mold trials, qualification, and New Product Introduction (NPI) activities to ensure smooth ramp‑up.
• Collaborate closely with tooling, quality, and production teams to drive process improvements.
• Develop, standardize, and maintain molding process specifications and technical documentation.
• Monitor key performance metrics and drive improvements in yield, cycle time, and scrap reduction.
• Lead and execute continuous improvement initiatives using Lean and Six Sigma methodologies.

Qualifications

• Graduate in Mechanical, Electronics & Communications, or Chemical Engineering (or equivalent).
• More than 10 years of experience in molding processes.
• Proven hands‑on experience with transfer molding equipment (e.g., TOWA, FUSEI).
• Strong knowledge of Epoxy Molding Compound (EMC), including material properties and processing behavior.
• Extensive familiarity with semiconductor package molding processes, including transfer molding, IC encapsulation, and discrete/power device packaging.
• Demonstrated expertise in troubleshooting complex molding issues and driving process optimization to improve yield, quality, and cycle time.
• Strong analytical and problem‑solving capabilities with a data‑driven approach.
• Effective communication and collaboration skills, able to work across cross‑functional teams.