Staff Process Engineer - Mold

Onsemi

Lapu-Lapu

On-site

PHP 600,000 - 1,000,000

Full time

4 hours ago
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Job summary

onsemi is seeking a senior molding expert in Lapu-Lapu City to lead transfer molding process optimization and ensure stable, high-quality production. You will troubleshoot complex molding issues, support NPI, and drive continuous improvement using Lean and Six Sigma methodologies.

Ideal candidates have a BS in Mechanical, Electronics & Communications, or Chemical Engineering, 10+ years in molding, hands-on with transfer molding equipment, and strong data-driven problem solving to improve yield,

Qualifications

  • BS in Mechanical Engineering, Electronics & Communications, or Chemical Engineering is required.
  • 10+ years of experience in molding processes.
  • Hands-on experience with transfer molding equipment (e.g., TOWA, FUSEI).
  • Knowledge of Epoxy Molding Compound (EMC) materials and processing.
  • Experience with semiconductor package molding: transfer molding, IC encapsulation, and packaging.
  • Strong troubleshooting and data-driven problem-solving abilities.
  • Excellent communication and cross-functional collaboration skills.

Responsibilities

  • Optimize molding process parameters for stable, high-quality output.
  • Diagnose and resolve molding defects through systematic troubleshooting.
  • Lead root cause analysis and CAPA, support mold trials and NPI.
  • Collaborate with tooling, quality, and production teams to improve processes.
  • Develop and maintain molding process specifications and documentation.
  • Monitor KPIs and drive yield, cycle time, and scrap improvements.
  • Lead continuous improvement initiatives using Lean and Six Sigma.

Skills

10+ years molding experience
Troubleshooting
Data-driven problem solving
Cross-functional collaboration
Lean Six Sigma
Process optimization
Yield improvement

Education

BS in Mechanical Engineering
BS in Electronics & Communications
BS in Chemical Engineering

Tools

Transfer molding equipment (TOWA, FUSEI)
EMC knowledge
Semiconductor packaging processes

Job description

Job Description

To serve as the technical expert in transfer molding processes by driving process optimization, improving product quality, and ensuring stable and efficient production performance. The role is responsible for troubleshooting complex molding issues, supporting new product introduction, and implementing continuous improvement initiatives.

Responsibilities
  • Optimize molding process parameters to ensure stable, repeatable, and high-quality production output
  • Diagnose and resolve molding defects (e.g., flash, mold bleed, package cracking, warpage) through systematic troubleshooting
  • Lead root cause analysis and implement effective corrective and preventive actions (CAPA)Support mold trials, qualification, and New Product Introduction (NPI) activities to ensure smooth ramp-up
  • Collaborate closely with tooling, quality, and production teams to drive process improvements
  • Develop, standardize, and maintain molding process specifications and technical documentation
  • Monitor key performance metrics and drive improvements in yield, cycle time, and scrap reduction
  • Lead and execute continuous improvement initiatives using Lean and Six Sigma methodologies
Qualifications
  • Must be either graduate in the field of BS in Mechanical or Electronics & Communications or Chemical Engineering, or equivalent.
  • More than 10 years of experience in molding process.
  • Proven hands-on experience with transfer molding equipment (e.g., TOWA, FUSEI)
  • Strong knowledge of Epoxy Molding Compound (EMC), including material properties and processing behavior
  • Extensive familiarity with semiconductor package molding processes, including transfer molding, IC encapsulation, and discrete/power device packaging
  • Demonstrated expertise in troubleshooting complex molding issues and driving process optimization to improve yield, quality, and cycle time
  • Strong analytical and problem-solving capabilities with a data-driven approach
  • Effective communication and collaboration skills, with the ability to work across cross-functional teams
About Us

onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.

More details about our company benefits can be found here:

We are committed to sourcing, attracting, and hiring high-performance innovators, while providing all candidates a positive recruitment experience that builds our brand as a great place to work.

Job Info
  • Job Identification 2505632
  • Job Category Manufacturing
  • Posting Date 06/17/2026, 11:51 PM
  • Degree Level Bachelors
  • Job Schedule Full time
  • Locations 2nd Street, Block-C3, Lapu-Lapu City, 6015, PH

2nd Street, Block-C3, Lapu-Lapu City, 6015, PH

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