Senior Engineer, NTI/NPI Interconnect Assembly Lead

Ampleon; Cabuyao; On-site; PHP 600,000 - 900,000; Full time

Benefits offered by this job

None

Job summary

Ampleon in Laguna, Philippines seeks a Sr. Engineer, NTI/NPI in Back-End Technology to lead and manage new technology, platform and product introduction for assembly processes focused on interconnect.

You will drive pre-development and development activities to enable high-volume manufacturing. Responsibilities include developing interconnect processes (wirebond, SMT, flip chip, etc.), applying PCP/APQP/DoE, establishing design rules, tooling, risk assessments and coordinating with

Qualifications

• You will have a degree in a related engineering field and PM experience in electronics manufacturing.
• PM methodologies and tools (PCP, APQP, DoE) are preferred.
• Familiar with Lean, Six Sigma, PFMEA, SPC, and Process Validation is a plus.
• PMP, CAPM or similar certification is a plus.

Responsibilities

• Lead and manage new technology, platform, and product introduction for Assembly Process focused on interconnect.
• Develop interconnect processes to support new products/packages and create new business opportunities.
• Evaluate and qualify new processes via DoE and release procedures to ensure readiness for high-volume production.
• Establish design rules and process roadmaps.
• Develop tooling and breakthrough procedures to improve development cycle time and efficiency.
• Provide day-to-day package/process support with emphasis on cost reduction and efficiency.
• Coordinate with manufacturing/QA/process engineers and support teams to transfer projects smoothly.
• Prepare and review DFMEA, DfM and Control Plan for NTI/NPI releases.

Skills

Leadership

Organizational skills

Communication

Problem-solving

Education

Bachelor's degree in Electronics Engineering, Electrical Engineering, Industrial Engineering, Manufacturing Engineering, or a related field.

Tools

PCP

APQP

DoE

Job description

Ampleon in Laguna, Philippines seeks a Sr. Engineer, NTI/NPI in Back-End Technology to lead and manage new technology, platform and product introduction for assembly processes focused on interconnect.

You will drive pre-development and development activities to enable high-volume manufacturing. Responsibilities include developing interconnect processes (wirebond, SMT, flip chip, etc.), applying PCP/APQP/DoE, establishing design rules, tooling, risk assessments and coordinating with