Semiconductor Assembly Quality Engineer - Defect Reduction

onsemi; Carmona; On-site; PHP 900,000 - 1,300,000; Full time

Job summary

onsemi in the Philippines is seeking an Assembly Quality Engineer to ensure product quality, process stability, and continuous improvement across FOL semiconductor assembly operations, including Wafer Saw, Die Attach/Die Bond, and Wire Bond processes.

This role drives defect prevention, yield improvement, customer satisfaction, and compliance with quality management system requirements through data analysis, problem-solving, and audits.

Qualifications

• Bachelor's degree in Engineering or related discipline required.
• Minimum 5 years of experience in semiconductor assembly manufacturing and quality engineering.

Responsibilities

• Monitor and analyze quality performance metrics for Wafer Saw, Die Bond, and Wire Bond processes.
• Lead investigation of assembly-related defects, yield excursions, customer complaints, and non-conformances using structured problem-solving methodologies (8D, DMAIC, 5 Why, Fishbone).
• Implement and verify corrective and preventive actions to eliminate recurring quality issues.
• Drive continuous improvement projects focused on defect reduction, process capability, yield enhancement, and cost of poor quality reduction.
• Review SPC data, Cp/Cpk, and quality trends to identify risks and opportunities for improvement.
• Support qualification and validation activities for new products, materials, equipment, and process changes.
• Conduct audits to ensure compliance with procedures, requirements, and standards.
• Collaborate with Manufacturing and Process Engineering to establish robust controls and checkpoints.
• Develop and maintain quality documentation (Control Plans, PFMEA, Inspection Standards, Work Instructions).
• Participate in customer audits and responses to quality concerns and corrective actions.
• Ensure compliance with ISO 9001, IATF 16949 where applicable.

Skills

Wafer Saw

Die Attach/Die Bond

Wire Bond

Education

Bachelor's Degree in Engineering

Tools

SPC

FMEA

MSA

Control Plans

DOE

CAPA

Root Cause Analysis

Job description

onsemi in the Philippines is seeking an Assembly Quality Engineer to ensure product quality, process stability, and continuous improvement across FOL semiconductor assembly operations, including Wafer Saw, Die Attach/Die Bond, and Wire Bond processes.

This role drives defect prevention, yield improvement, customer satisfaction, and compliance with quality management system requirements through data analysis, problem-solving, and audits.