Process Engineer – Wirebond/Die Attach & NPI Lead

Integrated Micro-Electronics, Inc. (IMI Global)

Philippines

On-site

PHP 300,000 - 600,000

Full time

3 days ago

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Job summary

Integrated Micro-Electronics, Inc. (IMI Global) is seeking a Process Engineer to develop, optimize, and stabilize manufacturing processes at Biñan, Laguna. You will support NPI through ramp-up and drive improvements in quality, yield, and productivity.

The role calls for an engineering degree with 2-4 years in process engineering or NPI, plus strong capabilities in wirebond or die attach and a proactive stance on continuous improvement.

Qualifications

Graduate of any Engineering course.
2-4 years of relevant experience in Process Engineering or NPI.
Strong background in Wirebond or Die Attach.
Knowledgeable in process development, process optimization, yield improvement, and continuous improvement initiatives.
Strong analytical, communication, and interpersonal skills.
Willing to work in Biñan, Laguna.

Responsibilities

Develop, implement, and optimize manufacturing processes to improve quality, yield, and productivity.
Support NPI activities from process qualification through production ramp-up.
Lead continuous improvement projects focused on quality, cost reduction, and operational efficiency.
Prepare and maintain process documentation, work instructions, and technical reports.

Skills

Process engineering

NPI

Wirebond

Die attach

Process development

Yield improvement

Continuous improvement

Analytical skills

Communication

Interpersonal skills

Education

Engineering degree

Job description

The role calls for an engineering degree with 2-4 years in process engineering or NPI, plus strong capabilities in wirebond or die attach and a proactive stance on continuous improvement.

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