Package / Process Development Engineer

ON Semiconductor; Carmona; On-site; PHP 500,000 - 800,000; Full time

Job summary

onsemi in the Philippines (Carmona, Cavite) is seeking a Lead R&D Engineer to drive die preparation process innovations, including laser groove, ablation, and advanced packaging techniques.

You will collaborate with cross-functional teams, develop experiments, analyze data, mentor junior engineers, and ensure compliance with industry standards while staying current with semiconductor packaging advances.

Qualifications

• Lead R&D initiatives in die preparation processes such as laser groove / ablation, mechanical dicing, stealth dicing.
• Collaborate with cross-functional teams to drive innovation and integrate new process technologies.
• Design and conduct experiments to develop and refine packaging processes.
• Analyze experimental data to identify trends and optimize process parameters.
• Develop comprehensive process documentation and control plans.
• Address and resolve complex process-related challenges.
• Stay abreast of the latest advancements in semiconductor packaging and incorporate cutting-edge techniques.
• Mentor and provide technical leadership to junior engineers and team members.
• Ensure all R&D activities comply with industry standards and company policies.

Responsibilities

• Lead R&D initiatives focused on die preparation processes like laser groove / ablation, mechanical dicing, stealth dicing.
• Collaborate with cross-functional teams to drive innovation and integrate new process technologies.
• Design and conduct experiments to develop and refine packaging processes.
• Analyze experimental data to identify trends and optimize process parameters.
• Develop comprehensive process documentation and control plans.
• Address and resolve complex process-related challenges.
• Stay abreast of the latest advancements in semiconductor packaging and incorporate cutting-edge techniques.
• Mentor and provide technical leadership to junior engineers and team members.
• Ensure all R&D activities comply with industry standards and company policies.

Job description

• Lead R&D initiatives focused on die preparation processes like but not limited to laser groove / ablation, mechanical dicing, stealth dicing.

• Collaborate with cross-functional teams to drive innovation and integrate new process technologies.

• Design and conduct experiments to develop and refine packaging processes.

• Analyze experimental data to identify trends and optimize process parameters.

• Develop comprehensive process documentation and control plans.

• Address and resolve complex process-related challenges.

• Stay abreast of the latest advancements in semiconductor packaging and incorporate cutting-edge techniques.

• Mentor and provide technical leadership to junior engineers and team members.

• Ensure all R&D activities comply with industry standards and company policies.

onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.

More details about our company benefits can be found here:

https://www.onsemi.com/careers/career-benefits

We are committed to sourcing, attracting, and hiring high-performance innovators, while providing all candidates a positive recruitment experience that builds our brand as a great place to work.