Panelization Engineer - Semiconductor Manufacturing

Microsemi; Philippines; Presencial; PHP 1.200.000 - 1.800.000; Jornada completa

Descripción de la vacante

Microchip Technology Inc. in the Philippines is seeking a Panelization Engineer to develop and optimize panel-level assembly processes for advanced semiconductor packaging, focusing on Die Attach, Screen Printing, and Lamination while ensuring quality and safety.

You will run DOE, monitor CPPs and KPIs, support NPI, troubleshoot issues, and collaborate with Production, Maintenance, Quality and Product Engineering to sustain manufacturing excellence.

Formación

• 3+ yrs of work experience in Equipment Engineering from Semiconductor or any equivalent industries.
• Strong knowledge of semiconductor equipment systems (mechanical, electrical, PLC, sensors, robotics).
• Basic understanding of statistical process control (SPC) and FMEA
• Strong analytical and problem-solving skills; ability to interpret SPC charts and process data.
• Good communication skills and ability to work in a team-oriented environment.
• Knowledge of safety protocols in chemical handling and cleanroom practices.
• Minimum 5-8 years of experience in semiconductor manufacturing equipment support.
• Strong experience with WLCSP or advanced packaging tools is highly preferred
• Experience with troubleshooting automation systems and control software.
• Ability to read technical schematics, manuals, and electrical diagrams.
• Proficiency in MS Office and maintenance management systems (CMMS is an advantage).
• Strong analytical and problem-solving skills

Responsabilidades

• Process Development and Optimization: Develop, qualify, and optimize panelization processes for advanced semiconductor package manufacturing.
• Establish and maintain robust process parameters for Die Attach, Chip Attach, Screen Printing, Plasma Cleaning/Treatment, Die Matrix Expander, Carrier Laminator.
• Conduct DOE to improve process capability, yield, and throughput.
• Implement process controls and monitor CPPs and KPIs.
• Support new product introductions (NPI) and technology transfers into manufacturing.
• Manufacturing Support: Provide day-to-day engineering support to production operations.
• Troubleshoot process-related issues and implement CAPA.
• Drive disposition and resolution of process excursions, non-conformances, and customer complaints.
• Collaborate with Production, Maintenance, Quality, and Product Engineering teams to ensure smooth manufacturing operations.
• Equipment and Technology Management: Support qualification, installation, and release of new process equipment.
• Develop equipment specifications and acceptance criteria.
• Coordinate preventive maintenance strategies and equipment capability improvements.
• Monitor machine performance metrics such as uptime, OEE, and process stability.
• Yield and Quality Management: Analyze manufacturing data using statistical tools to identify yield loss mechanisms.
• Drive continuous improvement projects focused on yield enhancement, defect reduction, cycle time reduction, and cost reduction.
• Apply SPC, FMEA, GR&R, 8D, and other quality methodologies.
• Ensure compliance with customer specifications and industry standards.

Conocimientos

Semiconductor equipment

SPC basics

FMEA

DOE

Data analysis

Quality tools

Team collaboration

Safety in cleanrooms

PLC & robotics

Schematic reading

Educación

Electronics Engineering

Mechanical Engineering

Manufacturing Engineering

Materials Science Engineering

Chemical Engineering

Related Engineering Discipline

Herramientas

CMMS

Descripción del empleo

Microchip Technology Inc. in the Philippines is seeking a Panelization Engineer to develop and optimize panel-level assembly processes for advanced semiconductor packaging, focusing on Die Attach, Screen Printing, and Lamination while ensuring quality and safety.

You will run DOE, monitor CPPs and KPIs, support NPI, troubleshoot issues, and collaborate with Production, Maintenance, Quality and Product Engineering to sustain manufacturing excellence.