ENGR STAFF PACKAGE DEVELOPMENT

onsemi; Carmona; Sur place; PHP 1 200 000 - 2 400 000; Plein temps

Résumé du poste

onsemi is seeking an experienced packaging development engineer in the Philippines to drive new package development from concept to fully functional prototypes. You will establish linkages with POC labs and providers for technology demonstrations and leverage IP considerations early in projects.

The role requires hands-on assembly development, 8 years in semiconductor packaging, and strong program management.

Qualifications

• Bachelors/Master of appropriate technical discipline; ie. Physics, Electrical Engineering, Chemical Engineering, Materials Science, Mechanical Engineering, Electronics and Communications Engineering
• 8 years of experience in semiconductor manufacturing, particularly in New Package/Product Development
• Hands-on assembly development and manufacturing experience.
• Analytical skills: process, materials and assembly equipment parameters
• Hands-on experience in program management

Responsabilités

• New package development - from conceptualization and ideation to creation of fully functional prototypes.
• Find/Create linkages with POC labs/providers (Eqpt, Material, Service providers)
• Physically conduct POC builds and/or technology demonstration with Provider
• Benchmark processes/technologies
• Provides POC development costing and project timing
• Follows the New Package Technology Development (12MON47078H) and H3 Ideation Flow
• Make sure we are covered with the Intellectual Property prior engagement
• Generate/Present POC and/or Technology demonstration reports to Stakeholders
• Technology Transfer to development site
• Provides intelligence on Package Technology/Market
• Responsible for New Package Development. Conducts tests and research on basic materials and properties involved in packaging. Develops solutions.
• Provides recommendations regarding technical approach or design, resource allocation, or project timing.
• Works with general guidance but independently determines the best approach for solving a problem.
• Conducts Design reviews and risk assessments with participation by other technical experts
• Manages the Technical risks of the projects assigned to ensure deployment of mitigation actions as per committed project timing
• Strong interaction with Manufacturing, Reliability and Business Units to close engineering gaps and for smooth production transfer.

Connaissances

New package development

Project management

Analytical skills

Engineering collaboration

Formation

Bachelor's degree in a technical discipline

Master's degree in a technical discipline

Outils

Process equipment

Laboratory equipment

Description du poste

Job Description

• New package development -from conceptualization and ideation to creation of fully functional prototypes.


• Find/Create linkages with POC labs/providers (Eqpt, Material, Service providers)


• Physically conduct POC builds and/or technology demonstration with Provider


• Benchmark processes/technologies


• Provides POC development costing and project timing


• Follows the New Package Technology Development (12MON47078H) and H3 Ideation Flow


• Make sure we are covered with the Intellectual Property prior engagement


• Generate/Present POC and/or Technology demonstration reports to Stakeholders


• Technology Transfer to development site


• Provides intelligence on Package Technology/Market


• Responsible for New Package Development. Conducts tests and research on basic materials and properties involved in packaging. Develops solutions.


• Provides recommendations regarding technical approach or design, resource allocation, or project timing.


• Works with general guidance but independently determines the best approach for solving a problem.


• Conducts Design reviews and risk assessments with participation by other technical experts


• Manages the Technical risks of the projects assigned to ensure deployment of mitigation actions as per committed project timing


• Strong interaction with Manufacturing, Reliability and Business Units to close engineering gaps and for smooth production transfer.
  

Qualifications

• Bachelors/Master of appropriate technical discipline; ie. Physics, Electrical Engineering, Chemical Engineering, Materials Science, Mechanical Engineering, Electronics and Communications Engineering


• 8 years of experience in semiconductor manufacturing, particularly in New Package/Product Development


• Hands-on assembly development and manufacturing experience.


• Analytical skills: process, materials and assembly equipment parameters


• Hands-on experience in program management
  

About Us

onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.

More details about our company benefits can be found here: https://www.onsemi.com/careers/career-benefits

About The Team

We are committed to sourcing, attracting, and hiring high-performance innovators, while providing all candidates a positive recruitment experience that builds our brand as a great place to work.