Engineer II-Equipment

Microsemi; Philippines; On-site; PHP 800,000 - 1,100,000; Full time

Job summary

Microchip Technology Inc. seeks a Panelization Engineer II to develop, optimize, and sustain panel-level assembly processes including Die Attach, Chip Attach, Screen Printing, Plasma Treatment, Die Matrix Expansion, and Carrier Lamination.

The role focuses on achieving high manufacturing performance through process control, DOE, and continuous improvement while ensuring safety and customer requirements. Collaboration with Production, Maintenance, Quality, and Product Engineering is essential.

Qualifications

• 3+ years of work experience in Equipment Engineering from Semiconductor or related industries.
• Strong knowledge of semiconductor equipment systems (mechanical, electrical, PLC, sensors, robotics).
• Basic understanding of SPC and FMEA.
• Strong analytical and problem-solving skills with ability to interpret SPC charts and process data.
• Good communication skills and teamwork in a cross-functional environment.
• Knowledge of safety protocols in chemical handling and cleanroom practices.

Responsibilities

• Develop, qualify, and optimize panelization processes for advanced semiconductor package manufacturing.
• Establish and maintain robust process parameters for Die Attach, Chip Attach, Screen Printing, Plasma Cleaning/Treatment, Die Matrix Expander, Carrier Laminator.
• Conduct DOE to improve process capability, yield, and throughput.
• Implement process controls and monitor CPPs and KPIs.
• Support new product introductions (NPI) and technology transfers into manufacturing.
• Provide day-to-day engineering support to production operations.
• Troubleshoot process-related issues and implement CAPA.
• Drive disposition and resolution of process excursions and customer complaints.

Skills

Semiconductor equipment knowledge

DOE and optimization

SPC & FMEA

Process control & KPI

Team collaboration

Problem solving

Education

Electronics/Mechanical/Manufacturing Engineering

Materials Science Engineering

Chemistry/Chemical Engineering

Tools

CMMS

Automation systems

Robotics

Job description

Are you looking for a unique opportunity to be a part of something great Want to join a 17,000-member team that works on the technology that powers the world around us Looking for an atmosphere of trust, empowerment, respect, diversity, and communication How about an opportunity to own a piece of a multi-billion dollar (with a B!) global organization We offer all that and more at Microchip Technology Inc.

People come to work at Microchip because we help design the technology that runs the world. They stay because our culture supports their growth and stability. They are challenged and driven by an incredible array of products and solutions with unlimited career potential. Microchip's nationally-recognized Leadership Passage Programs support career growth where we proudly enroll over a thousand people annually. We take pride in our commitment to employee development, values-based decision making, and strong sense of community, driven by our we affectionately refer to it as the and it's won us countless awards for diversity and workplace excellence.

Our company is built by dedicated team players who love to challenge the status quo we did not achieve record revenue and over without a great team dedicated to empowering innovation. People like you.

Visit our page to see what exciting opportunities and company await!

Job Description:

The Panelization Engineer II is responsible for developing, optimizing, and sustaining panel-level assembly processes including Die Attach, Chip Attach, Screen Printing, Plasma Treatment, Die Matrix Expansion, and Carrier Lamination operations. The role focuses on achieving high-quality manufacturing performance through process control, yield improvement, cost reduction, equipment optimization, and continuous improvement initiatives while ensuring compliance with customer, quality, and safety requirements.

Equipment Maintenance & Troubleshooting

Process Development and Optimization

• Develop, qualify, and optimize panelization processes for advanced semiconductor package manufacturing.
• Establish and maintain robust process parameters for:
  • Die Attach
  • Chip Attach
  • Screen Printing
  • Plasma Cleaning/Treatment
  • Die Matrix Expander
  • Carrier Laminator
• Conduct Design of Experiments (DOE) to improve process capability, yield, and throughput.
• Implement process controls and monitor critical process parameters (CPPs) and key performance indicators (KPIs).
• Support new product introductions (NPI) and technology transfers into manufacturing.

Manufacturing Support

• Provide day-to-day engineering support to production operations.
• Troubleshoot process-related issues and implement corrective and preventive actions (CAPA).
• Drive disposition and resolution of process excursions, non-conformances, and customer complaints.
• Collaborate with Production, Maintenance, Quality, and Product Engineering teams to ensure smooth manufacturing operations.

Equipment and Technology Management

• Support qualification, installation, and release of new process equipment.
• Develop equipment specifications and acceptance criteria.
• Coordinate preventive maintenance strategies and equipment capability improvements.
• Monitor machine performance metrics such as uptime, Overall Equipment Effectiveness (OEE), and process stability.

Yield and Quality Management

• Analyze manufacturing data using statistical tools to identify yield loss mechanisms.
• Drive continuous improvement projects focused on:

• Yield enhancement
• Defect reduction
• Cycle time improvement
• Cost reduction
• Apply SPC, FMEA, GR&R, 8D, and other quality methodologies.
• Ensure compliance with customer specifications, industry standards, and internal quality requirements.

Requirements/Qualifications:

Minimum Bachelor's Degree in:

Electronics Engineering

Mechanical Engineering

Manufacturing Engineering

Materials Science Engineering

Chemical Engineering

Related Engineering Discipline

• 3+yrs of work experience in Equipment Engineering from Semiconductor or any equivalent industries.
• Strong knowledge of semiconductor equipment systems (mechanical, electrical, PLC, sensors, robotics).
• Basic understanding of statistical process control (SPC) and FMEA
• Strong analytical and problem-solving skills ability to interpret SPC charts and process data.
• Good communication skills and ability to work in a team-oriented environment.
• Knowledge of safety protocols in chemical handling and cleanroom practices.
• Minimum 5-8 years of experience in semiconductor manufacturing equipment support.
• Strong experience with WLCSP or advanced packaging tools is highly preferred
• Experience with troubleshooting automation systems and control software.
• Ability to read technical schematics, manuals, and electrical diagrams.
• Proficiency in MS Office and maintenance management systems (CMMS is an advantage).
• Strong analytical and problem-solving skills