Engineer I -Process Ball Attach

Microchip Technology Inc.; Laguna; On-site; PHP 335,000 - 670,000; Full time

Job summary

Microchip Technology Inc. in Laguna is seeking a Ball Attach Engineer I to support and establish ball attach processes in PLP assembly operations.

You will drive start-ups, set initial process conditions, and sustain production performance for mass production. This role requires strong analytical skills, hands-on troubleshooting, and collaboration with Equipment, Quality, and Production teams to improve yield, efficiency, and reliability.

Qualifications

• Bachelor’s degree in Engineering with strong analytical capabilities.
• Experience with semiconductor WLCSP or BGA processes.
• Ability to interpret SPC charts and process data.

Responsibilities

• Lead and support start-up of ball attach line and new products.
• Establish initial process conditions and validate readiness for mass production.
• Monitor early production performance and stabilize during ramp-up.
• Identify root causes and implement corrective actions.
• Develop, define, and maintain ball attach process recipes.
• Perform DOE to determine optimal process windows.
• Ensure compliance with quality standards and SOPs.
• Coordinate with Equipment, Quality, and Production teams.

Skills

Analytical thinking

Troubleshooting

Communication skills

Teamwork

Problem solving

Leadership

Attention to detail

Data analysis

MS Office

Education

Bachelor’s Degree in Engineering

Tools

Packaging tools

DOE equipment

SPC

Job description

Are you looking for a unique opportunity to be a part of something great? Want to join a 17,000-member team that works on the technology that powers the world around us? Looking for an atmosphere of trust, empowerment, respect, diversity, and communication? How about an opportunity to own a piece of a multi-billion dollar (with a B!) global organization? We offer all that and more at Microchip Technology Inc.

People come to work at Microchip because we help design the technology that runs the world. They stay because our culture supports their growth and stability. They are challenged and driven by an incredible array of products and solutions with unlimited career potential. Microchip’s nationally-recognized Leadership Passage Programs support career growth where we proudly enroll over a thousand people annually. We take pride in our commitment to employee development, values-based decision making, and strong sense of community, driven by our Vision, Mission, and 11 Guiding Values; we affectionately refer to it as the Aggregate System and it’s won us countless awards for diversity and workplace excellence.

Our company is built by dedicated team players who love to challenge the status quo; we did not achieve record revenue and over 30 years of quarterly profitability without a great team dedicated to empowering innovation. People like you.

Job Description

The Ball Attach Engineer I is responsible for supporting, establishing, and improving ball attach processes in PLP assembly operations. The role includes start-up/line ramp activities, including process recipe creation and sustaining production performance, driving yield improvement, and actively participating in.

The position requires strong analytical capability, hands-on troubleshooting, and collaboration with cross-functional teams to ensure stable, efficient, and high-quality manufacturing operations.

• Lead and support start-up of Ball attach line and new products
• Establish initial process conditions and validate readiness for mass production
• Monitor early production performance and stabilize process during ramp-up phase
• Identify and mitigate start-up risks affecting yield, quality, and throughput
• Monitor and maintain ball attach process parameters to ensure stability and consistency
• Develop, define, and maintain ball attach process recipes (e.g., EFO settings, bonding force, ultrasonic power, time, temperature profiles)
• Perform DOE (Design of Experiments) to determine optimal process windows
• Continuously optimize recipes to improve yield, efficiency, and reliability
• Standardize and release qualified recipes for production use
• Ensure compliance with established process control plans and specifications
• Perform regular process audits and line checks
• Analyze yield trends and defect data (e.g., missing balls, ball bridging, ball deformation)
• Identify root causes and implement corrective and preventive actions
• Respond to production issues and equipment-related abnormalitiesConduct root cause analysis using standard methodologies (5 Whys, Fishbone, 8D)
• Coordinate with Equipment, Quality, and Production teams for resolution
• Participate in process improvement projects and cost reduction activities
• Recommend and implement best practices for improved efficiency
• Maintain and update process documentation including work instructions and SOPs
• Ensure compliance with internal quality standards and audit requirements
• Support internal and external Customer audits

Requirements/Qualifications

• Bachelor’s Degree in Engineering (Electronics, Industrial, Mechanical, Chemical, or equivalent)
• Minimum of 3 years experience in semiconductor specific to WLCSP or BGA process
• Experience on handling Ball Attach, Ball Repair, Reflow, Flux rinse and Shear process
• Working knowledge of SPC, MSA/GRR, DOE, PFMEA, and problem-solving methodologies.
• Strong analytical and problem-solving skills; ability to interpret SPC charts and process data.
• Good communication skills and ability to work in a team-oriented environment.
• Knowledge of safety protocols and cleanroom practices.
• Strong experience with WLCSP or advanced packaging tools is highly preferred
• Proficiency in MS Office and maintenance management systems.
• Strong analytical and problem-solving skills
• Leadership and mentoring capability
• Good communication and teamwork skills
• High attention to detail and sense of accountability

Travel Time

0% - 25%