System Solution Engineer - Optical Interconnect ICs for Datacom (d/m/f)

Ams Osram; Eindhoven; Hybrid; EUR 110,000 - 145,000; Full time

Job summary

ams OSRAM’s LSP unit seeks a senior technologist to translate customer architectures into differentiated IC concepts and drive CMOS system architectures across optics and packaging.

You will travel globally (approx. 50%), engage with hyperscalers and ecosystem partners, and articulate market needs to Product Management, R&D and Marketing. Excellent English is required; German is a plus.

Qualifications

• Master's degree or PhD in Electrical Engineering, Microelectronics, Photonics or Physics.
• Proven experience with mixed-signal CMOS, photodiodes, analog front-ends, drivers, TIAs or SerDes.
• Extensive industry experience in datacom, networking or optical interconnects.
• Strong system-level thinking across optics, electronics, packaging and integration.
• Experience working directly with customers on complex technical challenges and willingness to travel globally (approximately 50%) to engage with customers on-site.
• Excellent English communication skills; German is a plus.

Responsibilities

• Serve as a trusted technical advisor and build close relationships with key customers through regular on-site visits, providing technical leadership, gathering insights and identifying opportunities for future innovation
• Translate customer architectures and application requirements into differentiated Integrated Circuit (IC) product concepts and roadmaps
• Act as the technical voice of the customer across Product Management, R&D and Marketing
• Engage directly with hyperscalers, networking companies, optical module suppliers and ecosystem partners
• Drive the CMOS system architecture definition in the context of optics, photonics, mixed-signal ICs and packaging
• Analyze market trends, competing technologies and emerging optical interconnect architectures
• Identify CMOS IC technology gaps and recommend strategic investments for future product differentiation
• Support technical design-ins, customer evaluations and design-win activities worldwide
• Develop application notes, white papers, technical presentations and customer enablement materials
• Represent ams OSRAM at customer workshops, technical conferences and industry events

Skills

Mixed-signal CMOS

Photodiodes

Analog front-ends

TIAs/SerDes

Datacom/Networking/Interconnects

System-level thinking

Customer engagement

English proficiency

German a plus

Travel willingness

Education

Master's degree or PhD in Electrical Engineering, Microelectronics, Photonics or Physics

Job description

We are LSP - Light Sensors & Photonics, one of three business units within ams OSRAM, advancing the digitalization of light. At LSP, we go beyond traditional sensing - combining light, silicon, and system expertise to enable digital photonics solutions. Our focus is clear: powering next-generation applications in data centers, AR/VR, mobile and automotive, where light becomes a critical interface for data, perception, and interaction. This evolution marks a shift from components to integrated photonics systems -driving performance, scalability, and innovation in high-growth segments.

Join us in Premstätten, Regensburg, Pavia or Eindhoven and help define the future of optical connectivity for AI and data centers:

• Serve as a trusted technical advisor and build close relationships with key customers through regular on-site visits, providing technical leadership, gathering insights and identifying opportunities for future innovation
• Translate customer architectures and application requirements into differentiated Integrated Circuit (IC) product concepts and roadmaps
• Act as the technical voice of the customer across Product Management, R&D and Marketing
• Engage directly with hyperscalers, networking companies, optical module suppliers and ecosystem partners
• Drive the CMOS system architecture definition in the context of optics, photonics, mixed-signal ICs and packaging
• Analyze market trends, competing technologies and emerging optical interconnect architectures
• Identify CMOS IC technology gaps and recommend strategic investments for future product differentiation
• Support technical design-ins, customer evaluations and design-win activities worldwide
• Develop application notes, white papers, technical presentations and customer enablement materials
• Represent ams OSRAM at customer workshops, technical conferences and industry events

• Master's degree or PhD in Electrical Engineering, Microelectronics, Photonics or Physics
• Proven experience with mixed-signal CMOS, photodiodes, analog front-ends, drivers, TIAs or SerDes
• Extensive industry experience in datacom, networking or optical interconnects
• Solid understanding of datacenter (optical) links, transceivers and architectures
• Strong system-level thinking across optics, electronics, packaging and integration
• Experience working directly with customers on complex technical challenges and willingness to travel globally (approximately 50%) to engage with customers on-site
• Ability to translate market needs into differentiated semiconductor solutions
• Excellent English communication skills; German is a plus

For Austria: We offer competitive salaries and additional benefits based on your performance, experience and qualification.

The employment is in accordance with the collective salary and wage agreement for employees of the electrical and electronics industry, employment group H (https://www.feei.at/aktuelles/mindestloehne-und-gehaelter-eei/).
We offer a higher compensation depending on your expertise and skills.