Senior Process Engineer — Die Attach & Power Packaging

TNO; Netherlands; Hybrid; EUR 70,000 - 110,000; Full time

Benefits offered by this job

Holiday pay

13th month bonus

Flex budget

Relocation package

Pension plan

Flexible hours

Work-from-home option

Public transport allowance

Job summary

TNO is seeking a Senior Process Engineer to lead development of die attach solutions and packaging for power electronics in Nijmegen. You will drive design, experimentation and validation across customer projects within an international team.

Responsibilities include defining processes, DOE execution, data-driven improvements and supervision of students and junior engineers, with strong collaboration to translate concepts into manufacturable products.

Qualifications

• Minimum of 8 years of experience in semiconductor packaging development.
• Extensive knowledge of semiconductor assembly and packaging technologies.
• Experience with DoE methodologies, data analysis and experimental process development.

Responsibilities

• Define and optimize assembly processes and production flows for new die attach technologies.
• Design packages and packaging components for power electronics.
• Design tooling for packaging manufacturing and assembly.

Skills

Semiconductor packaging development

Semiconductor assembly technologies

DoE methodologies

Data analysis

AutoCAD

SolidWorks

Tools

AutoCAD

SolidWorks

Job description

TNO is seeking a Senior Process Engineer to lead development of die attach solutions and packaging for power electronics in Nijmegen. You will drive design, experimentation and validation across customer projects within an international team.

Responsibilities include defining processes, DOE execution, data-driven improvements and supervision of students and junior engineers, with strong collaboration to translate concepts into manufacturable products.