Associate Professor, Advanced Packaging & Integration

Delft University of Technology

Delft

Hybrid

EUR 70,000 - 100,000

Full time

14 days+

Get more replies from employers

Send a job-specific resume in minutes.

Benefits offered by this job

Customisable compensation package

Discounts on health insurance

Monthly work cost contribution

Flexible work schedules

Partial remote work

Job summary

Delft University of Technology's Section of Electronic Components, Technology and Materials (ECTM) invites applications for an Associate Professor in Advanced Packaging and Heterogeneous Integration. You will lead a world-class research program and shape future semiconductor system integration at TU Delft, contributing to AI, HPC, photonics, and automotive applications.

The position requires building collaborations with industry and academia, acquiring substantial funding, and delivering

Qualifications

PhD in Electrical Engineering, Materials Science, Mechanical Engineering, Applied Physics, or related field.
Strong international research track record with publications and/or patents.
Recognized expertise in advanced packaging and/or heterogeneous integration.
Proven ability to acquire competitive research funding.
Experience supervising PhD students and postdoctoral researchers.
Demonstrated ability to collaborate with industry.

Responsibilities

Develop an internationally visible and externally funded research program in advanced packaging and heterogeneous integration.
Provide scientific leadership and contribute to the strategic direction of the ECTM section.
Acquire substantial competitive funding from sources like NWO, Horizon Europe, Chips JU, and industry partnerships.
Build and expand collaborations with leading semiconductor companies and research institutes.
Contribute to education in microelectronics, including teaching and supervision of MSc and PhD students.
Strengthen TU Delft’s position in Europe’s semiconductor and packaging ecosystem.