3D Packaging Engineer

Entangled Future; Delft; Hybrid; EUR 60,000 - 85,000; Full time

Benefits offered by this job

8% holiday allowance

Generous pension plan

Hybrid work setup

L&D budget

Team events

Job summary

QuantWare in Delft is seeking a mid-level 3D Packaging Engineer to join the Research & Development team. The role focuses on high-precision assembly, 3D integration knowledge, and hands-on tooling with advanced semiconductor equipment.

The position emphasizes a hybrid work structure, competitive compensation, and an emphasis on professional growth and cutting-edge quantum packaging challenges. You will operate within a collaborative, high-performance team in a fast-moving field.

Qualifications

• Hands-on experience with high-precision assembly equipment.
• Experience achieving tight placement tolerances (~1 µm) in R&D/pilot production.
• Solid understanding of 3D integration concepts and materials behavior under thermal stress.

Responsibilities

• Tooling adaptation: modify and calibrate high-precision assembly equipment for 3D integration.
• Process optimization: refine placement and bonding processes for non-standard substrates.
• 3D assembly execution: execute complex strategies like multi-die stacking and interposer-based architectures.

Skills

Hands-on tooling experience

Precision assembly

3D integration knowledge

Education

BS/MS/PhD in Mechanical Engineering, Mechatronics, Physics, Materials Science

Tools

High-precision semiconductor assembly platforms

Thermo-compression bonding

Laser-assisted bonding

Job description

3D Packaging Engineer at QuantWare, Delft. A mid-level full time position in the Research & Development team, listed under hardware engineering.

At QuantWare, you’ll be part of a high-performing team of world-class experts in an ambitious, fast-moving environment. From day one, you’ll have the trust, tools, and support to do your best work. Here’s what you can expect: Competitive salary - A salary that reflects the impact and importance of the role (and of course 8% holiday allowance) Pension that’s built to last - A generous and future-proof pension plan that includes partner and dependent coverage.

Flexibility built on trust - We focus on outcomes. Work flexibly, in a hybrid setup, with an open vacation policy that lets you manage your time Personal growth - We invest in your L&D, with a budget available to each team member, dependent on their individual ambitions, development needs, and performance A connected team - We make space to celebrate wins together, with team events, offsites, and spontaneous moments that bring us closer

Responsibilities

• Tooling Adaptation: Assist in modifying and calibrating high-precision assembly equipment (e.g., flip-chip bonders, die attach machines) to meet unique quantum 3D integration specifications.
• Process Optimization: Help develop and refine placement and bonding processes (thermo-compression bonding, laser-assisted bonding, coldwelding) for non-standard substrates. Test adhesives, glues, and solders to determine which materials survive extreme thermal cycling and cryogenic vacuum conditions.
• 3D Assembly Execution: Execute complex integration strategies, including multi-die stacking, interposer-based 3D architectures, and orthogonal (vertical) chip placement.

Requirements

• Education: BS, MS, or PhD in Mechanical Engineering, Mechatronics, Physics, Materials Science, or a related field.
• Tooling Experience: 3–5 years of hands-on experience operating and adjusting high-accuracy semiconductor assembly platforms.
• Precision Assembly: Demonstrated experience achieving tight placement tolerances (around 1µm) in an R&D or pilot production environment.
• 3D Integration Knowledge: Solid foundational understanding of 3D integration (TSVs, micro-bumps, interposers) and how structural materials behave under thermal stress, high vacuum, or cryogenic conditions.