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Infineon Technologies AG in Malaysia is offering an Internship – Unit Process Development. This role focuses on supporting the DOE workflow for die clip attach processes, as well as collecting and analyzing DOE data to drive process understanding.
The internship requires a Bachelor's degree in Engineering or related field, CGPA 3.0+, and a minimum of 3 months of internship experience, with strong analytical, problem-solving and communication skills.
Infineon Technologies AG in Malaysia is offering an Internship – Unit Process Development. This role focuses on supporting the DOE workflow for die clip attach processes, as well as collecting and analyzing DOE data to drive process understanding.
The internship requires a Bachelor's degree in Engineering or related field, CGPA 3.0+, and a minimum of 3 months of internship experience, with strong analytical, problem-solving and communication skills.