Internship: Process Development & DOE (Die Clip Attach)

Infineon Technologies AG; Malacca City; On-site; MYR 10,000 - 17,000; Full time

Benefits offered by this job

null

Job summary

Infineon Technologies AG in Malaysia offers an internship under Unit Process Development. You will support engineering tasks by running DOE on the die clip attach process and assist with data collection and DOE analysis.

This internship targets engineering students, emphasising analytical, problem-solving, and communication skills, with a strong interest in semiconductor manufacturing and learning new tools and technologies.

Qualifications

• Bachelor Degree in Engineering or any other related field.
• Minimum CGPA of 3.00 and above.
• Minimum 3 months of internship.
• Good analytical, problem-solving and communication skills
• Demonstrates knowledge in semiconductor industry.
• Demonstrates interest to learn new technology and tools

Responsibilities

• Support Engineer to run DOE on die clip attach process.
• Perform data collection and analysis of the DOE.

Skills

Bachelor degree

CGPA 3.00+

Internship experience 3+ months

Analytical skills

Problem-solving skills

Communication skills

Semiconductor industry knowledge

Willingness to learn new tech/tools

Education

Bachelor Degree in Engineering or related field

CGPA 3.00+

Job description

Infineon Technologies AG in Malaysia offers an internship under Unit Process Development. You will support engineering tasks by running DOE on the die clip attach process and assist with data collection and DOE analysis.

This internship targets engineering students, emphasising analytical, problem-solving, and communication skills, with a strong interest in semiconductor manufacturing and learning new tools and technologies.