Turing Chip Project- Operation Manager

XPENG; Kuala Lumpur; On-site; MYR 90,000 - 130,000; Full time

Job summary

XPENG in Malaysia seeks a hands-on Senior Operations / Project Manager to lead vendor and production management for chip packaging and testing (OSAT). You will coordinate schedules, capacity, and mass production readiness, and drive quality improvements in a fast-setup environment.

The role requires strong government relations, regulatory compliance, and cross-cultural communication with HQ. You will build partnerships with local authorities, ensure permits, and optimize local workflows while

Qualifications

• Bachelor’s degree in a technical field as listed.
• 5+ years in operations or project management in semiconductors.
• Background in chip packaging and testing (OSAT) mass production.
• Strong knowledge of backend semiconductor processes and QA standards.
• Experience with government relations and local regulatory environments (Malaysia).
• Fluent in English and Mandarin; Malay is a plus.
• Proficient in mainstream project management tools.

Responsibilities

• Vendor & Production Management coordinating OSAT factories and schedules.
• Quality Assurance plans for packaging/testing and mass production readiness.
• Collect and analyze data to identify bottlenecks and improve workflows.
• Develop government relations and ensure regulatory compliance and permits.

Skills

Negotiation

Cross-cultural comm

Coordination

Risk management

Proactivity

English & Mandarin

Education

Bachelor’s degree or above in Microelectronics, Electrical/Electronic Eng, Automation, CS or related field

Job description

• Vendor & Production Management: Act as the primary interface with external packaging and testing factories (OSATs). Manage production schedules, capacity planning, quality control, and yield improvement to ensure the successful and timely delivery of chip products.
• Quality Assurance: Formulate end-to-end quality assurance plans for the packaging and testing phases. Conduct process audits and manage quality control to guarantee the success of mass production.
• Continuous Improvement: Collect and analyze operational and project data. Identify bottlenecks, drive cross-functional issue resolution, and continuously optimize local operational workflows and supply chain efficiency.
• Government Relations & Compliance: Build and liaise robust relationships with relevant Malaysian government departments, local authorities, and industry bodies. Ensure corporate regulatory compliance, secure necessary operational permits, and facilitate the smooth establishment and daily operations of the company.

Qualifications:

• Education: Bachelor’s degree or above in Microelectronics, Electronic Engineering, Automation, Computer Science, or related technical fields.
• Industry Experience: 5+ years of operational or project management experience in the semiconductor industry, with a strong, specific background in chip packaging and testing (OSAT) management and successful mass production track records.
• Technical Knowledge: Deep understanding of semiconductor backend processes, including advanced packaging technologies, testing methodologies, and relevant quality control standards.
• Local Expertise: Proven experience in government relations, public affairs, or corporate setup. Familiarity with Malaysia's local business environment, regulatory policies, and administrative procedures is highly preferred.
• Soft Skills: Highly proactive and responsible, with exceptional negotiation, cross-cultural communication, coordination, and risk management capabilities. Able to thrive in a fast-paced, setup-phase environment.
• Language: Fluent in both written and spoken English and Mandarin (essential for seamless communication with the headquarters). Proficiency in Malay is a strong advantage.
• Tools: Proficient in mainstream project management and operational tools.