Test Engineer

BizLink Technology (S.E.A.) Sdn. Bhd.; Seberang Perai; On-site; MYR 60,000 - 90,000; Full time

Job summary

BizLink Technology (S.E.A.) Sdn. Bhd. seeks an engineer skilled in signal integrity and electromagnetic modelling to support high-speed design validation in Penang. You will perform both frequency and time-domain analyses, and collaborate with design teams to ensure protocol and channel constraints are met.

Responsibilities include 3D EM simulations, substrate/channel modelling, and producing detailed lab reports using VNA, microscopes, and power meters.

Qualifications

• Experience in SI/PI analysis and high-speed signal integrity techniques.
• Familiarity with lab measurements using VNA, oscilloscopes, and power meters.
• Collaboration with design and PCB layout teams to meet signal quality constraints.

Responsibilities

• Perform frequency and time-domain SI/PI analyses and report key results.
• Model substrate/PCB channels using 3D EM simulation tools and 3D field solvers (HFSS).
• Generate implementation guidelines for layout improvements to meet signal quality requirements.
• Create lab measurement reports using high-end instruments (VNA, microscopes, meters).

Skills

Frequency domain analysis

Time domain analysis

Timing and Jitter

Cross-Talk

Noise analysis

IBIS/IBIS-AMI simulations

Tools

HFSS

Vector Network Analyzer

Power Meter

Microscope

Job description

• Performed both Frequency and Time domain methods of SI/PI analysis.
• Carried out Timing and Jitter, Cross-Talk and Noise, Channel Modelling and SerDes Equalizations, PDN and De-Coupling Analysis.
• Worked with Design Engineers, PCB Layout and other Simulation Engineers to develop and ensure appropriate delivery and compliance of recommended product design constraints and Module design guides.
• Participated in performing modelling of package substrate/PCB channels elements in 3D/2D EM simulation tools.
• Generated implementation guidelines for the layout improvements required to meet the Signal Quality requirements using 3D field and channel simulators (HFSS).
• Familiarised with PCB stack-up design, trade-offs in line geometries, PCB materials and surface finishes, vendor capabilities, Wire Harness and Cable Manufacturing Processes.
• Performed High Speed IO Interface technologies like, Via Modelling, Antipad Optimization, TDR, Multi-Board channel simulation, On-Board IBIS/IBIS-AMI simulations, COM analysis etc.
• Performed SI key parameters measurement, to full fill product requirements, and generate lab measurement reports using Lab instruments such as Microscopes/Network Analyzer, VNA, or High-power meters etc.