Senior Staff Engineer Unit Process Development Flip Chip

Infineon Technologies; Malacca City; On-site; MYR 90,000 - 150,000; Full time

Job summary

Infineon Technologies in Malaysia seeks an experienced Process Development Engineer to advance Front-of-Line and Die Attach processes. You will develop new techniques, run DOEs, and collaborate with Operations to scale prototypes and ensure quality.

You will lead cross-functional teams, drive problem solving, and contribute to continuous improvement in a fast-paced semiconductor environment. This role emphasizes safety, quality, and efficiency.

Qualifications

• Master's or Bachelor's Degree in Engineering or related discipline.
• Minimum 4 years in semiconductor manufacturing or related industries.
• Hands-on knowledge in Front-of-Line (FOL) and Die Attach processes (Flip Chip, Flux Dip, Reflow).
• Proficiency in JMP, Minitab, or equivalent DOE and statistical tools.
• Strong analytical, problem-solving, and project planning skills.
• Strong communication, presentation, interpersonal, and teamwork skills; ability to lead cross-functional teams.
• Knowledge of material interactions in the die attach ecosystem; Six Sigma is a plus.

Responsibilities

• Conduct process development activities, including parameter scouting, optimization, verification, characterization, and freeze to meet timeline, quality, cost, and manufacturability goals.
• Develop innovative processes and characterization methodologies; perform risk assessments and identify technical challenges.
• Support prototype and development sample builds; ensure effective communication and knowledge transfer to Operations.
• Prepare and maintain development documentation (Process Specs, Design Rules, Roadmaps, FMEA, WI).
• Collaborate with suppliers on improvements and verify/qualify new tooling, equipment, and materials.
• Provide technical guidance to project teams for daily activities and deliverables.
• Lead task forces using statistical methods (Root Cause Analysis, 5 Whys, DMAIC, 8D).

Skills

FOL Die Attach

DOE & Statistics

Analytical Skills

Cross-functional Leadership

Project Planning

Communication Skills

Six Sigma Knowledge

Education

Bachelor's or Master's in Engineering

Tools

JMP

Minitab

Job description

#WeAreIn for jobs that impact everyone's life.

Join the thinkers, builders, and problem-solvers behind tomorrow’s technology.

Your role

Key responsibilities in your new role

• Conduct process development activities, including process parameter scouting, optimization, verification, process characterization, and process freeze, to achieve project objectives in terms of timeline, quality, cost competitiveness, and manufacturability.
• Develop innovative processes and process characterization methodologies for existing and new technologies, while performing risk assessments and identifying technical challenges.
• Support prototype and development sample builds, and ensure effective technical communication and knowledge transfer to Operations.
• Prepare, maintain, and ensure the accuracy of development-related documentation, including Process Specifications, Assembly Design Rules, Process Roadmaps, Failure Catalogues, Control Plans, FMEA, OJTI/WI, and T32.
• Collaborate with suppliers on continuous improvement initiatives and perform verification and qualification activities for new tooling, equipment, and materials used in development projects.
• Provide technical consultation and guidance to project teams to support the successful execution of daily activities and project deliverables.
• Lead task forces and complex problem-solving activities using statistical and analytical methodologies, including Root Cause Analysis, 5 Whys, DMAIC, and 8D.

Your profile

Qualifications And Skills To Help You Succeed

• Master's or Bachelor's Degree in Engineering or a related discipline.
• Minimum 4 years of working experience in the semiconductor manufacturing industry or other relevant industries.
• Strong hands-on knowledge and technical expertise in Front-of-Line (FOL) and Die Attach processes, including Flip Chip, Flux Dip, and Reflow.
• Proficiency in JMP, Minitab, or equivalent tools for Design of Experiments (DOE) and statistical analysis.
• Strong analytical, problem-solving, and project planning skills, with a strong sense of quality and urgency.
• Strong communication, presentation, interpersonal, and teamwork skills, with the ability to work independently and lead cross-functional teams.
• Technical knowledge of material interactions within the die attach ecosystem and structured problem-solving methodologies, including 8D and Six Sigma, is an added advantage.

#WeAreIn for driving decarbonization and digitalization.

As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.

Are you in?

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We strive to create the best Infineon for everyone by embracing diversity and inclusion. We welcome applicants for who they are and offer a workplace built on trust, openness, respect and equal opportunity.

Our hiring decisions are based on skills and experience. Even if you don’t meet every requirement, we encourage you to apply.

Please let your recruiter know if you need any accommodations during the interview process.

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