Staff Engineer Tape Out Enablement

Infineon; Penang; On-site; MYR 240,000 - 360,000; Full time

Job summary

Infineon Technologies AG in Malaysia seeks a Staff Engineer for Tape Out Enablement to drive complex semiconductor tapeouts from development through manufacturing. You will enable tapeouts with external fabs, manage transfers, and lead cross-functional teams across design, technology, and manufacturing.

You will interface with multiple foundries and build strong relationships to ensure timely, high-quality tapeout deliveries.

Qualifications

• Degree in Electrical Engineering, Physics or a similar discipline.
• 6+ years in semiconductor industry focusing on new technology development, physical design and tapeout enablement.
• In-depth knowledge of CMOS, FinFET manufacturing processes.
• Experience with physical verification and signoff tools (Cadence, Synopsys).
• Proven experience with foundries (TSMC, GlobalFoundries, UMC). Familiarity with mask and data preparation tools is a plus.
• Affinity to AI-driven applications in semiconductor design and manufacturing.
• Strong technical leadership and cross-functional collaboration across teams.

Responsibilities

• Enable tapeouts at external fabs and manage transfers from in-house.
• Serve as technical interface to foundries and build relationships for successful tapeout enablement.
• Plan and track high-quality, on-time tapeout deliveries in NTI and NPI projects.
• Collaborate with technology development, design and manufacturing for seamless support and manage shifting priorities.
• Define and document best fit to internal gds2mask and tapeout management system.
• Work with internal and external stakeholders to implement robust tapeout processes along qualification and production flows.
• Provide technical guidance on foundry-specific design, verification and tapeout requirements.

Skills

Tapeout enablement

Cross-functional leadership

Foundry interface

Technical leadership

Education

Electrical Engineering

Tools

Cadence

Synopsys

Mask/data prep tools

Job description

Join us as a Staff Engineer Tape Out Enablement and play a critical role in enabling complex semiconductor designs from development to manufacturing. Work alongside global teams, drive process improvements, and contribute to technologies that power a greener, smarter, and more connected world.

Your role

• Be responsible for enabling tapeouts at external fabs and transfers from in house.
• Be for all tapeout aspects the technical interface to the foundries of interest and responsible for building and maintaining relationships for successful tapeout enablement.
• As Work Package Contributor in NTI and NPI projects be responsible for planning and tracking of high-quality and in-time tapeout deliveries.
• Partner with cross-functional teams, including technology development, design and manufacturing for a seamless technical support while handling at the same time shifting priorities and timelines.
• Actively contribute to the definition, implementation and documentation of the best fit to the internal gds2mask and tapeout management system.
• Work closely with relevant stakeholders, both internal and at external abs, to implement robust and efficient tapeout processes along the qualification and production flows.
• Provide technical guidance and support to internal design teams on foundry-specific design, verification and tapeout requirements.

Qualifications and skills to help you succeed

• A degree in Electrical Engineering, Physics or a similar discipline.
• Minimum 6+ years of experience in semiconductor industry, with a focus on new technology development, physical design and tapeout enablement.
• In-depth knowledge of semiconductor manufacturing processes and technologies in CMOS, FinFET, etc.
• Experience with physical verification and signoff tools (e.g., Cadence, Synopsys, etc.)
• Proven experience with foundries (TSMC, GlobalFoundries, UMC, etc.).Familiarity with mask and data preparation tools and methodologies isa PLUS.
• Affinity to or experience with AI-driven application in semiconductor design and manufacturing.
• Strong technical leadership and communication skills, with experience of working in cross-functional teams and collaborating with senior management.
• Ability to work in an international, multicultural and multidisciplinary environment.

#WeAreIn for driving decarbonization and digitalization. As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener. Are you in? We are on a journey to create the best Infineon for everyone. We strive to create the best Infineon for everyone by embracing diversity and inclusion. We welcome applicants for who they are and offer a workplace built on trust, openness, respect and equal opportunity. Please let your recruiter know if you need any accommodations during the interview process. Learn more about our various contact channels and about Diversity & Inclusion at Infineon.