Senior Staff Engineer Unit Process Development Flip Chip

Infineon Technologies; Malacca City; On-site; MYR 180,000 - 240,000; Full time

Job summary

Infineon Technologies in Malaysia seeks a Senior Staff Engineer in Unit Process Development Flip Chip to drive advanced packaging processes and improve manufacturability.

You will develop FOL and Die Attach processes, lead cross-functional teams, and deliver robust process documentation while collaborating with suppliers and Operations to enable scalable, high-quality technology.

Qualifications

• Master's or Bachelor's Degree in Engineering or related discipline.
• 4+ years of experience in semiconductor manufacturing or related industries.
• Hands-on knowledge in Front-of-Line (FOL) and Die Attach processes including Flip Chip, Flux Dip, and Reflow.
• Proficiency in JMP or Minitab for DOE and statistical analysis.
• Strong analytical, problem-solving and project planning skills.
• Strong communication and teamwork skills; ability to lead cross-functional teams.
• Knowledge of Six Sigma, 8D as an added advantage.

Responsibilities

• Conduct process development activities to achieve project objectives in terms of timeline, quality, cost, and manufacturability.
• Develop innovative processes and characterization methodologies; perform risk assessments and identify technical challenges.
• Support prototype and development sample builds; ensure effective communication to Operations.
• Prepare, maintain and ensure accuracy of development documentation (Process Specifications, FMEA, etc.).
• Collaborate with suppliers on continuous improvement initiatives and verify new tooling/equipment/materials.
• Provide technical consultation to project teams for successful daily activities and deliverables.
• Lead task forces using RCA, 5 Whys, DMAIC, and 8D.

Skills

FOL & Die Attach

DOE & Statistical Analysis

Analytical & problem-solving

Communication & teamwork

Six Sigma / 8D

Education

Bachelor's or Master's in Engineering

Tools

JMP

Minitab

Job description

#WeAreIn for jobs that impact everyone's life.

Join the thinkers, builders, and problem-solvers behind tomorrow’s technology.

As a Senior Staff Engineer Unit Process Development Flip Chip in our Research & Development team, you'll have the opportunity to merge creativity with your technical expertise by shaping the future of technology, driving groundbreaking projects, and bringing new ideas to life.

Are you in?

Your role

Key responsibilities in your new role

• Conduct process development activities, including process parameter scouting, optimization, verification, process characterization, and process freeze, to achieve project objectives in terms of timeline, quality, cost competitiveness, and manufacturability.
• Develop innovative processes and process characterization methodologies for existing and new technologies, while performing risk assessments and identifying technical challenges.
• Support prototype and development sample builds, and ensure effective technical communication and knowledge transfer to Operations.
• Prepare, maintain, and ensure the accuracy of development-related documentation, including Process Specifications, Assembly Design Rules, Process Roadmaps, Failure Catalogues, Control Plans, FMEA, OJTI/WI, and T32.
• Collaborate with suppliers on continuous improvement initiatives and perform verification and qualification activities for new tooling, equipment, and materials used in development projects.
• Provide technical consultation and guidance to project teams to support the successful execution of daily activities and project deliverables.
• Lead task forces and complex problem-solving activities using statistical and analytical methodologies, including Root Cause Analysis, 5 Whys, DMAIC, and 8D.

Your profile

Qualifications And Skills To Help You Succeed

• Master's or Bachelor's Degree in Engineering or a related discipline.
• Minimum 4 years of working experience in the semiconductor manufacturing industry or other relevant industries.
• Strong hands-on knowledge and technical expertise in Front-of-Line (FOL) and Die Attach processes, including Flip Chip, Flux Dip, and Reflow.
• Proficiency in JMP, Minitab, or equivalent tools for Design of Experiments (DOE) and statistical analysis.
• Strong analytical, problem-solving, and project planning skills, with a strong sense of quality and urgency.
• Strong communication, presentation, interpersonal, and teamwork skills, with the ability to work independently and lead cross-functional teams.
• Technical knowledge of material interactions within the die attach ecosystem and structured problem-solving methodologies, including 8D and Six Sigma, is an added advantage.

#WeAreIn for driving decarbonization and digitalization.

As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.

Are you in?

We are on a journey to create the best Infineon for everyone.

We strive to create the best Infineon for everyone by embracing diversity and inclusion. We welcome applicants for who they are and offer a workplace built on trust, openness, respect and equal opportunity.

Our hiring decisions are based on skills and experience. Even if you don’t meet every requirement, we encourage you to apply.

Please let your recruiter know if you need any accommodations during the interview process.

Learn more about our various contact channels and about Diversity & Inclusion at Infineon.