Staff Process Engineer (Plasma)

OSRAM Opto Semiconductors (Malaysia) Sdn Bhd; Kedah; On-site; MYR 100,000 - 167,000; Full time

Job summary

ams OSRAM Malaysia is seeking a qualified engineer to own plasma etching processes in ICP chambers. The role involves driving improvements for cycle time, CPk, scrap, throughput, and cost reductions while addressing deviations and defects.

Responsibilities include root cause analysis, corrective actions, and maintaining SOPs, OCAPs, FMEA, and ECP documents. Effective communication in English and Bahasa Malaysia is required.

Qualifications

• Candidate must have at least a Bachelor's Degree or above in Engineering.
• Min 3 years of experience in wafer fabrication specialized in dry plasma etching. Experience in PeCVD is an added advantage.
• Technical knowledge in the area of electronics and/or semiconductor wafer fabrication.
• Knowledge of problem solving skill, 6Sigma DMAIC approach.
• Skilled in SPC/8D/6Sigma/DOE and Literate in statistic software such as JMP/Minitab/Corenerstone.
• Good communication skill in English and Bahasa Malaysia.

Responsibilities

• Primary owner for plasma etching processes(GaN/SiO2/SiN/ALD film) in ICP chambers .
• Carry out improvement activities related to plasma etching topic (cycle time improvement, CPk improvement, scrap reduction, etag reduction, troughput improvement, cost reduction, new tool start-up and etc).
• Analyze root causes for any process deviations, defects, and yield losses topics related to plasma processes/tools.
• Providing resolution(corrective/preventive action plan) to process issues related to plasma etching.
• Monitor SPC chart and provide improvement plan to ensure Cpk > 1.67
• Maintain and update Standard Operating Procedures (SOPs), process specification, Out of Control Plan(OCAP), FMEA and ECP documents.
• Attend MRB for non-coformance lot disposition and follow up on 8D topic.

Skills

Root cause analysis

DMAIC

SPC

6Sigma

DOE

Problem solving

Education

Bachelor's Degree in Engineering

Tools

JMP

Minitab

Cornerstone

Job description

Primary owner for plasma etching processes(GaN/SiO2/SiN/ALD film) in ICP chambers .

Carry out improvement activities related to plasma etching topic (cycle time improvement, CPk improvement, scrap reduction, etag reduction, troughput improvement, cost reduction, new tool start-up and etc).

Analyze root causes for any process deviations, defects, and yield losses topics related to plasma processes/tools.

Providing resolution(corrective/preventive action plan) to process issues related to plasma etching.

Monitor SPC chart and provide improvement plan to ensure Cpk > 1.67

Maintain and update Standard Operating Procedures (SOPs), process specification, Out of Control Plan(OCAP), FMEA and ECP documents.

Attend MRB for non-coformance lot disposition and follow up on 8D topic.

Job Requirements

Candidate must have at least a Bachelor's Degree or above in Engineering.

Min 3 years of experience in wafer fabrication specialized in dry plasma etching. Experience in PeCVD is an added advantage.

Technical knowledge in the area of electronics and/or semiconductor wafer fabrication.

Knowledge of problem solving skill, 6Sigma DMAIC approach.

Skilled in SPC/8D/6Sigma/DOE and Literate in statistic software such as JMP/Minitab/Corenerstone.

Good communication skill in English and Bahasa Malaysia.

About ams OSRAM

The ams OSRAM Group is a global leader in innovative light and sensor solutions.

With more than 110 years of industry experience, we combine engineering excellence and global manufacturing with a passion for cutting-edge innovation enabling transformative advancements in the automotive, industrial, medical, and consumer industries.

“Sense the power of light” – our success is based on the deep understanding of the potential of light and distinct portfolio of emitter and sensor technologies. Around 19,700 employees worldwide drive innovations alongside societal megatrends.