Senior Staff Engineer Process Development

Infineon Technologies AG; Kulim; On-site; MYR 80,000 - 100,000; Full time

Job summary

A leading semiconductor company in Malaysia is seeking an experienced engineer to perform process transfer and development. The ideal candidate will bring expertise in wafer thinning processes and be skilled in cross-functional teamwork. This role offers a dynamic and inclusive work environment focused on innovation and quality improvement.

Benefits

Diversity and inclusion initiatives

Opportunities for career growth

Qualifications

• 3-5 years of hands-on experience in wafer thinning/preassembly processes.
• Experience with semiconductor unit processes and device physics.
• Effective in technology transfer, qualification, and high-volume ramp-up.

Responsibilities

• Perform process transfer, development, and qualification.
• Develop innovative process methodologies for new technologies.
• Initiate productivity and quality improvement projects.

Skills

Process development

Wafer thinning process

Effective communication

Education

Bachelor/Master/PhD in relevant engineering fields

Tools

Wafer fabrication equipment

Job description

Perform process transfer, process development, optimization, and qualification for technology transfer and/or used tool transfer.

1. Development of innovative processes and process characterization methodologies for existing and new technologies.
2. Partnering with production modules/departments, technology integration, planning, business divisions, and global process development counterparts in mapping and enabling future technologies.
3. Perform process stability, sustaining, and improvement to meet overall company targets.
4. Perform integration block re-use and tool extendibility to maximize re-use strategy.
5. Perform FMEA, risk assessment of process changes, and process change management.
6. Initiate, coordinate, and support excursion prevention, productivity, and quality improvement projects.
7. Interface between production modules/departments, technology integration, and quality engineering on daily routines.

Qualifications:

1. Bachelor/Master/PhD degree in Mechanical Engineering, Mechatronics Engineering, Material Science, Applied Science, Manufacturing Engineering, or related engineering fields.
2. 3-5 years of hands-on experience in wafer thinning/preassembly processes (grinding, tape & de tape, mounting & demounting, carrier systems, dicing, frame mounting, separation), and related equipment engineering.
3. Experience and good methodical techniques in technology synchronization and process harmonization.
4. Good knowledge of semiconductor unit processes, process integration, device physics, and products (advantageous).
5. Hands-on experience with wafer fabrication processes, equipment, and metrology.
6. Knowledge of technology and/or product transfer, qualification, and high-volume ramp-up.
7. Highly innovative, motivated, stress-resistant individual with a zero-defect mindset.
8. Effective communication skills and ability to work in cross-functional teams at all levels.

#WeAreIn for driving decarbonization and digitalization.

As a global leader in semiconductor solutions in power systems and IoT, Infineon enables solutions for green energy, clean mobility, and smart IoT. Join us in making life easier, safer, and greener.

We embrace diversity and inclusion, offering a work environment based on trust, openness, respect, and tolerance. We are committed to equal opportunities for all applicants and employees.