Senior SMT Process & Packaging Engineer

Sandisk; Seberang Perai; On-site; MYR 60,000 - 80,000; Full time

Job summary

A leading semiconductor company in Malaysia is looking for a Staff Engineer specializing in SMT Process Module Engineering. The ideal candidate will define IC package and solder materials for SSDs and be responsible for developing assembly and packaging processes. This role requires at least 5 years of engineering experience in the semiconductor industry, with a strong emphasis on problem-solving and collaboration. The company values diversity, aiming to create an inclusive environment where every employee can thrive.

Qualifications

• Minimum 5 years of relevant work experience, or 2 years for PhD.
• Experience in engineering role within the semiconductor industry.
• Strong understanding of technical fundamentals and problem-solving.

Responsibilities

• Define IC package/SMT/SSD drive requirements.
• Develop SSD assembly and IC packaging materials and processes.
• Maintain product quality while developing package cost reduction programs.

Skills

AI/ML experience

Strong verbal and written communications

Education

Bachelor/Master/PhD in engineering/material/science

Tools

Minitab

JMP

Excel

Job description

A leading semiconductor company in Malaysia is looking for a Staff Engineer specializing in SMT Process Module Engineering. The ideal candidate will define IC package and solder materials for SSDs and be responsible for developing assembly and packaging processes. This role requires at least 5 years of engineering experience in the semiconductor industry, with a strong emphasis on problem-solving and collaboration. The company values diversity, aiming to create an inclusive environment where every employee can thrive.