Senior SMT Process Engineer — NPI & Warpage Expert

SANMINA-SCI SYSTEMS (MALAYSIA) SDN BHD

Seberang Perai

On-site

MYR 90,000 - 150,000

Full time

14 days+

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Job summary

SANMINA-SCI SYSTEMS (MALAYSIA) SDN BHD is seeking a Senior Process Engineer to lead SMT and SOM package development, drive NPI builds from prototype to mass production, and ensure high yield, quality and reliability of advanced PCBA assemblies.

The role requires hands-on expertise in Shadow Moiré analysis for warpage characterization, DOE execution, and process optimization, with strong collaboration across design, materials and quality teams.

Qualifications

Bachelor’s Degree in Electronics, Manufacturing, or Mechanical Engineering (or equivalent).
Minimum 2 years hands-on SMT / PCBA / SOM process development or NPI experience.
In-depth SMT fundamentals: reflow profiling, stencil design, solder paste rheology, AOI/SPC control.
Experience in Shadow Moiré warpage analysis and interpreting thermal co-planarity results.
Proficiency in DOE, SPC, CPK, and DMAIC/5-Why/Fishbone problem-solving methods.
Familiar with IPC-A-610, J-STD-001, and JEDEC standards.
Excellent analytical, documentation, and communication skills.

Responsibilities

Lead SMT process development, optimization, and qualification for SOM and PCBA assemblies.
Plan, execute, and interpret DOE to establish robust process windows.
Drive NPI builds from prototype to mass production with documentation.
Define and control critical process parameters: stencil design, paste selection, and reflow profile.
Perform Shadow Moiré testing to assess warpage and impact on yield.
Coordinate with design, material, and quality teams to implement improvements.
Conduct DFM/DFT reviews, void reduction trials, and co-planarity control.
Maintain PFMEA, Control Plan, Process Flow, and Work Instructions.