Senior PCB Layout Engineer (High-Density Multi-Layer / Cadence)

Capcon Consulting; Kuala Lumpur; Hybrid; MYR 120,000 - 180,000; Part time

Benefits offered by this job

Hybrid work setup

KL City with LRT/KTM access

2-year extendable contract

Job summary

Capcon Consulting in Kuala Lumpur is seeking a Senior PCB Layout Engineer to lead complex, high-density, multi-layer board designs using Cadence layout tools. You will drive impedance control and RF path routing for sophisticated analog, digital, and RF circuits.

This role offers a hybrid work arrangement (3 days in office, 2 days at home) and a 2-year extendable contract. The candidate should have 5+ years of hands-on PCB layout experience and a strong background in stackups, DFM, and DFA.

Qualifications

• 5+ years of dedicated, high-density multi-layer PCB layout experience.
• Expert-level use of Cadence layout tools, AutoCAD and CAM350.
• Deep knowledge of stackups, DFM and DFA manufacturing rules.

Responsibilities

• Execute intricate multi-layer PCB layouts for analog, digital, and RF circuits.
• Build and standardize global schematic symbols and precise footprint packages.
• Implement layout constraints for impedance control and EMI mitigation.
• Generate full fabrication packages and liaise with PCB factories.

Skills

PCB layout

High-density layouts

Multi-layer design

RF routing

High-speed buses

Tools

Cadence layout tools

AutoCAD

CAM350

Job description

Intro: Looking for a Senior PCB Layout Engineer in Kuala Lumpur. Take charge of complex high-density, multi-layer board designs using Cadence layout tools. Must have strong experience with high-speed digital buses and RF paths. 3-day hybrid work setup.

Why you should apply

• The Ultimate Engineering Puzzle: Route multi-layer boards matching high-speed digital buses with sensitive RF paths.
• True Architectural Partner: Escape basic layouts where trace routing constraints do not matter.
• Schematic to Reality: Shape the signal and power paths that turn high-frequency designs into physical products.

Project / Client: A premier, iconic global telecommunications pioneer renowned for shaping carrier-grade mobile networks and setting the benchmark for international connectivity standards.

What you will do

• Execute intricate multi-layer PCB layouts for analog, digital, and RF circuits.
• Build and standardize global schematic symbols and precise footprint packages.
• Implement layout constraints for strict impedance control and EMI mitigation.
• Generate full fabrication packages and resolve queries directly with PCB factories.

Experience you need

• 5+ years of dedicated, high-density multi-layer PCB layout experience.
• Expert-level daily utilization of Cadence layout tools, AutoCAD, and CAM350.
• Deep knowledge of multi-layer stackup design, DFM, and DFA manufacturing rules.

Work Arrangement / Benefits

• Hybrid: 3 days a week in office / 2 days home.
• KL City (LRT / KTM accessible)
• Contract: 2-year extendable contract.