Senior Packaging Development Engineer

Monolithic Power Systems, Inc.; Penang; On-site; MYR 90,000 - 130,000; Full time

Benefits offered by this job

Attractive compensation

Supportive work environment where your

World of opportunities for your career

Job summary

Monolithic Power Systems, Inc. (MPS) in Malaysia seeks a Packaging Engineer to design, develop and scale advanced packages and modules for industrial, automotive, renewable and telecom markets.

You will translate system requirements into package specifications, perform thermal and electrical analyses, and use AutoCAD and SolidWorks to create robust designs. The role involves collaboration with cross-functional teams, suppliers and customers, with opportunities for innovation and professional

Qualifications

• BS or MS in Mechanical, Materials Science, Electrical Engineering or related engineering degree.
• 3+ years of experience in design of packages and modules.
• Proficiency in CAD software: AutoCAD and SolidWorks.
• Deep understanding in packaging technologies, process flow, material, qualification and manufacturing implementation.
• Knowledge of thermal, electrical and mechanical finite FEA/CFD simulation software tools and simulation methods used for semiconductor packaging and board level applications.
• ANSYS Icepak/Q3D/Mechanical preferred.
• System level simulation skill is a plus.
• Excellent communication, writing and presentation skills.
• Strong innovation, problem solving mindset.

Responsibilities

• Design, develop and scale to volume production of new packages and modules for the industrial, automotive, renewable and telecom markets.
• The candidate can understand system requirements and build these into the definition of the package/power module to meet electrical, thermal, and mechanical specifications.
• Capabilities to independently use simulation software.
• Interact with internal cross-function teams, subcontractors and material suppliers to develop new packages, assembly processes and technologies.
• Optimize the assembly materials and processes with best package performance & reliability, maximize manufacturing yield, and minimize assembly cost.
• Benchmark the competitions in package design, assembly materials and assembly processes, and create a new methodology, technology and intellectual property.
• Direct support for multiple product lines and customers.

Skills

Package design

AutoCAD

SolidWorks

FEA/CFD simulations

ANSYS Icepak

System-level simulation

Thermal analysis

Communication skills

Problem solving

Education

Bachelor's or Master’s in Mechanical/Materials/EE

Tools

ANSYS Icepak

Q3D

ANSYS Mechanical

Job description

MonolithicPowerSystems,Inc.(MPS)isoneofthefastestgrowingcompaniesintheSemiconductorindustry.WeareworldwidetechnicalleadersinIntegratedPowerSemiconductorsandSystemsPowerdeliveryarchitectures.AtMPS,wecultivatecreativity,arepassionateaboutsustainability,andarecommittedtoprovidingleading-edgeproductsandinnovationtoourcustomers.Ourportfoliooftechnologyhelpspowerourworld—comejoinourteamandseehowYOUcanmakeadifference.

Job Description:

RESPONSIBILITIES:

• Design, develop and scale to volume production of new packages and modules for the industrial, automotive, renewable and telecom markets.
• The candidate can understand system requirements and build these into the definition of the package/power module to meet electrical, thermal, and mechanical specifications.
• Capabilities to independently use simulation software.
• Interact with internal cross-function teams, subcontractors and material suppliers to develop new packages, assembly processes and technologies.
• Optimize the assembly materials and processes with best package performance & reliability, maximize manufacturing yield, and minimize assembly cost.
• Benchmark the competitions in package design, assembly materials and assembly processes, and create a new methodology, technology and intellectual property.
• Direct support for multiple product lines and customers.

REQUIREMENTS:

• BS or MS degree in Mechanical, Material Science, Electrical Engineering or related engineering degree.
• 3+ years of experience in design of packages and modules.
• Proficiency in CAD software: Auto CAD and SolidWorks preferred.
• Deep understanding in various packaging technologies, process flow, material, qualification and manufacturing implementation.
• Knowledge of thermal, electrical and mechanical finite FEA/CFD simulation software tools and simulation methods used for semiconductor packaging and board level applications.
• ANSYS Icepak/Q3D/Mechanical Preferred.
• System level simulation skill is a plus.
• Excellent communication, writing and presentation skills.
• Strong innovation, problem solving mindset.

Benefits:

• Attractive compensation.
• Supportive work environment where your ideas count, and you can thrive in a diverse culture.
• World of opportunities for your personal and professional development.

Monolithic Power Systems, Inc. (MPS) is an Equal Opportunity Employer and embraces diversity in our employee population. It is the policy of MPS to provide equal opportunity to all qualified applicants and employees without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, age, disability, protected veteran status or special disabled veteran, marital status, pregnancy, genetic information, or any other legally protected status.